发明授权
US06892927B2 Method and apparatus for bonding a wire to a bond pad on a device
失效
将导线接合到装置上的接合焊盘的方法和装置
- 专利标题： Method and apparatus for bonding a wire to a bond pad on a device
- 专利标题（中）： 将导线接合到装置上的接合焊盘的方法和装置
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申请号： US10423117申请日： 2003-04-24
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公开(公告)号： US06892927B2公开(公告)日： 2005-05-17
- 发明人: Christopher L. Rumer , Gregory S. Clemons
- 申请人： Christopher L. Rumer , Gregory S. Clemons
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： B23K20/00
- IPC分类号： B23K20/00 ; B23K20/10 ; B23K20/24 ; H01L21/607 ; B23K37/00 ; B23K1/06 ; B23K5/20 ; B23K31/02
摘要：
A method of bonding a wire to a bond pad on an electronic or photonic device is provided. A section of the wire is held within a bond head of the wirebonding apparatus. A laser beam is directed onto the bond pad. Energy of the laser beam heats the bond pad to the temperature that is higher than the temperature of the device. The bond head is subsequently moved toward the device to bring a portion of the wire into contact with the bond pad. Ultrasonic energy is provided to an interface between the portion of the wire and the bond pad.
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