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    WELDING METHOD FOR MANUFACTURING TOOL PARTS
    2.
    发明公开
    WELDING METHOD FOR MANUFACTURING TOOL PARTS 审中-公开

    公开(公告)号：US20240123540A1

    公开(公告)日：2024-04-18

    申请号：US18046837

    申请日：2022-10-14

    申请人： Man Cheong LI

    发明人： JingHua ZHI

    IPC分类号： B23K20/02 ,  B23K20/22 ,  B23K20/24

    CPC分类号： B23K20/02 ,  B23K20/22 ,  B23K20/24 ,  B23K2101/002

    摘要： The method of manufacturing a tool part includes the steps of providing a first shaft portion and a separate second shaft portion formed of a different material to the first shaft portion, the first shaft portion having a first contacting face at an end thereof, and the second shaft portion having a second contacting face at an end thereof. The method also includes aligning the first and second shaft portions along a common central axis; contacting the first contacting face with the second contacting face; and passing a current through the first and second shaft portions. The temperature increases at an interface between the first and second contacting faces, and pressure is simultaneously applied between the first and second shaft portions in a direction of the common central axis, thereby welding the first shaft portion to the second shaft portion—to form a shaft of the tool part.

    LOW TEMPERATURE HYBRID BONDING
    5.
    发明公开
    LOW TEMPERATURE HYBRID BONDING 审中-公开

    公开(公告)号：US20230201952A1

    公开(公告)日：2023-06-29

    申请号：US17563830

    申请日：2021-12-28

    申请人： ADVANCED MICRO DEVICES, INC.

    发明人： PRIYAL SHAH ,  RAHUL AGARWAL ,  RAJA SWAMINATHAN ,  BRETT P. WILKERSON

    IPC分类号： B23K20/02 ,  B23K20/24

    CPC分类号： B23K20/02 ,  B23K20/24 ,  B23K2101/40

    摘要： A semiconductor device includes a first die, the first die including a first dielectric layer and a plurality of first bond pads formed within apertures in the first dielectric layer, and a second die bonded to the first die, the second die including a second dielectric layer and a plurality of second bond pads protruding from the second dielectric layer. The first die is bonded to the second die such that the plurality of second bond pads protrude into the apertures in the first dielectric layer to establish respective metallurgical bonds with the plurality of first bond pads. A reduction in the distance between the respective bond pads of the dies results in a lower temperature for establishing a hybrid bond.

    METHODS FOR METAL FLOW REACTOR MODULES AND MODULES PRODUCED
    6.
    发明公开
    METHODS FOR METAL FLOW REACTOR MODULES AND MODULES PRODUCED 审中-公开

    公开(公告)号：US20230150050A1

    公开(公告)日：2023-05-18

    申请号：US17914085

    申请日：2021-03-29

    申请人： CORNING INCORPORATED

    发明人： George Edward Berkey ,  Richard Alan Quinn

    IPC分类号： B23K20/02 ,  B01J19/24 ,  B23K20/24 ,  B23K35/36

    CPC分类号： B23K20/02 ,  B01J19/249 ,  B23K20/24 ,  B23K35/3602 ,  B01J2219/2493 ,  B01J2219/2486

    摘要： A method for forming a metal flow module includes stacking together a first metal plate having opposing first and second major surfaces and one or more flow channels defined at least in part in the first major surface with a second metal plate having opposing first and second major surfaces, the plates stacked together with their respective first major surfaces facing each other and with a layer of flux positioned in between contacting portions of the respective first major surfaces defined as those portions of the respective first and second major surfaces which would be in contact absent the flux; then heating the plates together in a non-oxidizing atmosphere to thermally bond the contacting portions of the respective first major surfaces of the first and second metal plates. Resulting modules are also disclosed.

    SYSTEMS AND METHODS FOR MAKING A COMPOSITE THICKNESS METAL PART
    7.
    发明申请
    SYSTEMS AND METHODS FOR MAKING A COMPOSITE THICKNESS METAL PART 有权

    公开(公告)号：US20230096278A1

    公开(公告)日：2023-03-30

    申请号：US17490375

    申请日：2021-09-30

    申请人： Wiegel Tool Works, Inc.

    发明人： Mark Andrew LAKIS ,  Joseph Vincent MANSCHULA

    IPC分类号： B23K20/10 ,  B23K20/24 ,  B26F1/02

    摘要： The disclosure herein describes various methods for producing a composite thickness metal part. Such methods include cutting out a base component having a first thickness, cutting out a foil sheet having a second thickness less than the first thickness, and loading the base component and the foil sheet into a fixture. Then the methods include passing the fixture containing the base component and the foil sheet through an ultrasonic welding machine to join the foil sheet to the base component and form an interim part that includes the foil sheet joined to the base component and cutting away preselected sections of the foil sheet from the interim part to produce a final geometry of the composite thickness metal part.

    APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
    10.
    发明申请
    APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME 有权

    公开(公告)号：US20220148978A1

    公开(公告)日：2022-05-12

    申请号：US17455611

    申请日：2021-11-18

    申请人： NIKON CORPORATION

    发明人： Isao SUGAYA ,  Kazuya OKAMOTO ,  Hajime MITSUISHI ,  Minoru FUKUDA

    IPC分类号： H01L23/544 ,  B23K20/02 ,  H01L21/67 ,  H01L21/683 ,  B23K20/00 ,  B23K37/04 ,  H01L21/68 ,  H01L21/687 ,  B23K20/24 ,  H01L23/00 ,  B65H31/34

    摘要： A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.