Invention Grant
- Patent Title: Silicon-based dielectric tunneling emitter
- Patent Title (中): 硅基电介质隧道发射极
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Application No.: US10755890Application Date: 2004-01-12
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Publication No.: US06902458B2Publication Date: 2005-06-07
- Inventor: Zhizhang Chen , Michael David Bic , Ronald L. Enck , Michael J. Regan , Thomas Novet , Paul J. Benning
- Applicant: Zhizhang Chen , Michael David Bic , Ronald L. Enck , Michael J. Regan , Thomas Novet , Paul J. Benning
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Timothy F Myers
- Main IPC: G11C13/04
- IPC: G11C13/04 ; H01J1/312 ; H01J9/02 ; H01J19/24 ; H01J21/06 ; H01J29/04 ; H01J31/12 ; H01L29/06 ; H01J9/04

Abstract:
An emitter has an electron supply layer and a silicon-based dielectric layer formed on the electron supply layer. The silicon-based dielectric layer is preferably less than about 500 Angstroms. Optionally, an insulator layer is formed on the electron supply layer and has openings defined within which the silicon-based dielectric layer is formed. A cathode layer is formed on the silicon-based dielectric layer to provide a surface for energy emissions of electrons and/or photons. Preferably, the emitter is subjected to an annealing process thereby increasing the supply of electrons tunneled from the electron supply layer to the cathode layer.
Public/Granted literature
- US20040140748A1 Silicon-based dielectric tunneling emitter Public/Granted day:2004-07-22
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