发明授权
- 专利标题： Device and method for forming bump
- 专利标题（中）： 用于形成凸块的装置和方法
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申请号： US10332026申请日： 2001-06-29
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公开(公告)号： US06910613B2公开(公告)日： 2005-06-28
- 发明人: Shoriki Narita , Koichi Yoshida , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama , Makoto Imanishi , Kazushi Higashi , Kenji Fukumoto , Hiroshi Wada
- 申请人： Shoriki Narita , Koichi Yoshida , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama , Makoto Imanishi , Kazushi Higashi , Kenji Fukumoto , Hiroshi Wada
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2000-202700 20000704
- 国际申请： PCT/JP01/05609 WO 20010629
- 国际公布： WO02/03447 WO 20020110
- 主分类号： H05K3/34
- IPC分类号： H05K3/34 ; B23K20/00 ; H01L21/00 ; H01L21/60 ; B23K37/00 ; H01L21/44
摘要：
A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).
公开/授权文献
- US20040102030A1 Device and method for forming bump 公开/授权日：2004-05-27
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