公开(公告)号：US07861908B2

公开(公告)日：2011-01-04

申请号：US11731312

申请日：2007-03-30

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

摘要翻译： 部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。 安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。 因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

公开(公告)号：US20050191838A1

公开(公告)日：2005-09-01

申请号：US11114084

申请日：2005-04-26

申请人： Shoriki Narita ,  Koichi Yoshida ,  Masahiko Ikeya ,  Takaharu Mae ,  Shinji Kanayama ,  Makoto Imanishi ,  Kazushi Higashi ,  Kenji Fukumoto ,  Hiroshi Wada

发明人： Shoriki Narita ,  Koichi Yoshida ,  Masahiko Ikeya ,  Takaharu Mae ,  Shinji Kanayama ,  Makoto Imanishi ,  Kazushi Higashi ,  Kenji Fukumoto ,  Hiroshi Wada

IPC分类号： H05K3/34 ,  B23K20/00 ,  H01L21/00 ,  H01L21/60 ,  H01L21/44

CPC分类号： H01L24/742 ,  H01L21/67138 ,  H01L21/67144 ,  H01L21/67248 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10329 ,  H01L2924/351 ,  Y10T29/4921 ,  H01L2924/00 ,  H01L2924/00014

摘要： A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).

摘要翻译： 提供预热装置（160），用于在形成凸起（16）到电极部件（15）之前执行用于粘接促进的预制温度控制，以促进在凸起形成期间电极部件和凸块之间的接合。 电极部分的金属颗粒可以在凸点形成之前变成适当的状态。 与现有技术相比，现在可以改善电极部分和凸块之间的结合状态。 在本发明的另一方面中，通过控制器（317）的加热来控制加热，可以通过接合台（316）在接合强度改善条件下加热具有凸块的半导体部件。

公开(公告)号：US06787391B1

公开(公告)日：2004-09-07

申请号：US09719768

申请日：2000-12-18

申请人： Makoto Imanishi ,  Shoriki Narita ,  Masahiko Ikeya ,  Shinji Kanayama ,  Takaharu Mae

发明人： Makoto Imanishi ,  Shoriki Narita ,  Masahiko Ikeya ,  Shinji Kanayama ,  Takaharu Mae

IPC分类号： H01L2148

CPC分类号： H01L21/67288 ,  H01L21/67144 ,  H01L21/67248 ,  H01L2924/0002 ,  Y10T29/41 ,  H01L2924/00

摘要： A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.

摘要翻译： 提供了一种在与半导体晶片形成凸块时进行与传统技术不同的类型的温度控制的凸块形成装置以及由凸块形成装置执行的凸块形成方法。 提供接合台，负载和传送装置以及控制装置。 在其上形成有凸块之后，晶片由负载和转移装置保持，并且通过控制装置的控制而布置在接合台上方，从而控制晶片的温度降。 因此，可以防止由于热应力等而产生诸如裂纹的故障甚至使对温度变化敏感的半导体晶片复合。

公开(公告)号：US06619535B1

公开(公告)日：2003-09-16

申请号：US09830508

申请日：2001-04-27

申请人： Makoto Imanishi ,  Takahiro Yonezawa ,  Shinji Kanayama ,  Ryoichiro Katano ,  Takaharu Mae

发明人： Makoto Imanishi ,  Takahiro Yonezawa ,  Shinji Kanayama ,  Ryoichiro Katano ,  Takaharu Mae

IPC分类号： B23K3102

CPC分类号： H01L21/6838 ,  H01L21/68 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a construction including a stage having a suction hole for sucking an electronic component and fixing the same in position and position regulating suction hole for sucking an electronic component when the electronic component is regulated in position, a position regulating pawl for positioning the electronic component on the stage and a position regulating suction force control section capable of controlling a position regulating suction force when the electronic component is regulated in position on the stage.

摘要翻译： 本发明提供一种结构，其特征在于，包括具有用于吸引电子部件的吸引孔并将其固定在适当位置的台阶的结构，以及当电子部件被调节就位时，用于吸引电子部件的位置调节用吸孔; 以及位置调整用吸引力控制部，其能够控制在电子部件被调节到台上的位置时调节吸引力的位置。

公开(公告)号：US6098868A

公开(公告)日：2000-08-08

申请号：US423375

申请日：1999-11-04

申请人： Takaharu Mae ,  Kiyoshi Mayahara ,  Shoriki Narita ,  Masaya Watanabe ,  Yuichi Takakura ,  Masahiko Ikeya

发明人： Takaharu Mae ,  Kiyoshi Mayahara ,  Shoriki Narita ,  Masaya Watanabe ,  Yuichi Takakura ,  Masahiko Ikeya

IPC分类号： B23K20/00 ,  H01L21/00 ,  B23K31/02 ,  H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/41

CPC分类号： H01L24/78 ,  B23K20/007 ,  H01L24/11 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L24/12 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/14

摘要： A bump forming method comprising a first step of forming a ball (5) at a distal end of a wire (4) which protrudes from a lower end of a capillary (12); a second step of opening a damper (11) which securely holds the wire (4) above the capillary (12) and bringing down the capillary (12) as well as the damper (11), in which an amount of movement of the damper (11) is smaller than that of the capillary (12) by such an amount as to be equivalent to a length of the wire (4) being protruded from the lower end of the capillary (12) in the first step; a third step of forming a bump (21) from the ball (5) by bonding; and a fourth step of separating the wire (4) from the bump (21) by closing the damper (11) and lifting up the damper (11) and the capillary (21) to an initial position of the first step as well as causing a distal end of the wire (4) to protrude from the lower end of the capillary (12) by a predetermined length, whereby a step of drawing out a leading end of the wire (4) from the capillary (12) is eliminated.

摘要翻译： PCT No.PCT / JP98 / 02253 Sec。 371日期：1999年11月4日 102（e）1999年11月4日日期PCT提交1998年5月12日PCT公布。 WO98 / 53485 PCT公开号 日期：1998年11月26日一种凸块成形方法，包括在从毛细管（12）的下端突出的线材（4）的远端形成球（5）的第一步骤; 打开阻尼器（11）的第二步骤，其将所述线材（4）牢固地保持在所述毛细管（12）上方并使所述毛细管（12）以及所述阻尼器（11）以及所述阻尼器（11） （11）的长度小于毛细管（12）的等于在第一步骤中从毛细管（12）的下端突出的线材（4）的长度的量; 通过接合从球（5）形成凸块（21）的第三步骤; 以及第四步骤，通过关闭所述阻尼器（11）并将所述阻尼器（11）和所述毛细管（21）提升到所述第一步骤的初始位置，从而将所述电线（4）与所述凸块（21）分离，以及引起 电线（4）的远端从毛细管（12）的下端突出预定的长度，从而从毛细管（12）抽出导线（4）的前端的步骤被消除。

公开(公告)号：US4763811A

公开(公告)日：1988-08-16

申请号：US891028

申请日：1986-07-31

申请人： Takaharu Mae ,  Hiromi Kinoshita ,  Yoshinobu Maeda ,  Koji Fujiwara ,  Hiroshi Nakagawa

发明人： Takaharu Mae ,  Hiromi Kinoshita ,  Yoshinobu Maeda ,  Koji Fujiwara ,  Hiroshi Nakagawa

IPC分类号： B65G47/08 ,  B65G1/00 ,  B65G1/02 ,  B65G1/08 ,  B65G59/06 ,  H05K13/00 ,  H05K13/02

CPC分类号： H05K13/02 ,  H05K13/0084

摘要： A parts feeder includes a stock unit containing a plurality of magazine units arranged side by side and each storing a stack of magazines accommodating an array of parts, and a supply unit for supporting magazines delivered respectively from the magazine units in the stock unit. Parts can be supplied, one at a time, from any of the magazines in the supply unit. The supply unit is movable independently of the stock unit. When any magazine unit runs short of magazines, such a magazine unit can be supplied with new magazines loaded with parts without shutdown of the parts feeder.

摘要翻译： 零件进给器包括一个储存单元，该储存单元包含并排布置的多个仓库单元，每个储存一堆容纳一系列零件的仓库;以及一个供应单元，用于支撑分别从库存单元中的仓库单元输送的杂志。 可以从供应单位的任何杂志提供零件，一次一个。 供应单元可独立于库存单元移动。 当任何杂志单元缺少杂志时，这样的杂志单元可以提供装载零件的新的杂志，而不会关闭零件馈送器。

公开(公告)号：US07516878B2

公开(公告)日：2009-04-14

申请号：US11317146

申请日：2005-12-27

申请人： Shoriki Narita ,  Masahiko Ikeya ,  Yasutaka Tsuboi ,  Takaharu Mae ,  Shinji Kanayama

发明人： Shoriki Narita ,  Masahiko Ikeya ,  Yasutaka Tsuboi ,  Takaharu Mae ,  Shinji Kanayama

IPC分类号： B23K37/00 ,  B23K37/04

CPC分类号： H01L23/544 ,  B23K20/007 ,  H01L24/11 ,  H01L24/12 ,  H01L2223/54453 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599

摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.

摘要翻译： 提供了一种用于半导体晶片的凸块形成方法和凸块形成装置，其中与常规技术相比，提高了在半导体晶片上形成凸块时的生产率。 提供了凸块形成头，识别装置和控制装置。 形成在半导体晶片上的IC被分成基本块。 对于包含在一个基本块中的IC，连续执行凸块形成。 只有当凸块形成操作从一个基本块移动到另一个基本块时，才执行其他基本块的位置识别。 因此，与在每个IC上形成凸块时进行位置识别操作的现有技术相比，大大降低了执行位置识别的次数，从而可以提高生产率。

公开(公告)号：US07350684B2

公开(公告)日：2008-04-01

申请号：US11114084

申请日：2005-04-26

申请人： Shoriki Narita ,  Koichi Yoshida ,  Masahiko Ikeya ,  Takaharu Mae ,  Shinji Kanayama ,  Makoto Imanishi ,  Kazushi Higashi ,  Kenji Fukumoto ,  Hiroshi Wada

发明人： Shoriki Narita ,  Koichi Yoshida ,  Masahiko Ikeya ,  Takaharu Mae ,  Shinji Kanayama ,  Makoto Imanishi ,  Kazushi Higashi ,  Kenji Fukumoto ,  Hiroshi Wada

IPC分类号： B23K37/00

CPC分类号： H01L24/742 ,  H01L21/67138 ,  H01L21/67144 ,  H01L21/67248 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10329 ,  H01L2924/351 ,  Y10T29/4921 ,  H01L2924/00 ,  H01L2924/00014

摘要： A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).

摘要翻译： 提供预热装置（160），用于在形成凸起（16）到电极部件（15）之前执行用于粘接促进的预制温度控制，以促进在凸块形成期间电极部件和凸块之间的接合。 电极部分的金属颗粒可以在凸点形成之前变成适当的状态。 与现有技术相比，现在可以改善电极部分和凸块之间的结合状态。 在本发明的另一方面中，通过控制器（317）的加热来控制加热，可以通过接合台（316）在接合强度改善条件下加热具有凸块的半导体部件。

公开(公告)号：US20070187457A1

公开(公告)日：2007-08-16

申请号：US11731312

申请日：2007-03-30

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

摘要翻译： 部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。 安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。 因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

公开(公告)号：US07229854B2

公开(公告)日：2007-06-12

申请号：US10508460

申请日：2003-03-27

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： H01L21/50

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.

摘要翻译： 一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8） 所述基板以及将所述部件与所述基板对准的定位装置（6,7）。 安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如 振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。 因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。