A photosensitive resin composition for using in combination with a photosensitizer comprises an active component selected from an active metal alkoxide represented by the formula (1) or a polycondensate thereof and a particle represented by the formula (2), (X)m-n-Mm-[(U1)p—(U2-Z)t]n  (1) P—[(Y)s—{(U1)p—(U2-Z)t}]k  (2) wherein, X shows a hydrogen, a halogen, an alkoxy group or an alkoxycarbonyl group, M shows a metal atom whose valence m is not less than 2, U1 shows a first connecting unit, U2 shows a second connecting unit and Z shows a group causing a difference in solubility by light exposure, P shows a fine particle carrier, Y shows a coupling residue, n shows an integer of not less than 1 and m>n, p shows 0 or 1, t shows 1 or 2, k shows an integer of not less than 1, and s shows 0 or 1). The unit (U1)p—(U2-Z)t is represented by the following formula: f(R1)q-(B)r]p-({(R2),,-(Ar)v}-Zlt (wherein, R1 and R2 show an alkylene or alkenylene group; and B shows an ester bond, an amide bond, a urea bond, a urethane bond, an imino group, a sulfur atom or a nitrogen atom; Ar represents an arylene or cycloalkylene group; each of the factors, q, r, a and v, shows 0 or 1, and q+r+u+vzl; and Z, p and t have the same meanings defined above).