Invention Grant
US06936769B1 Electronic part mounting substrate, electronic part, and semiconductor device
有权
电子部件安装基板，电子部件和半导体器件
- Patent Title: Electronic part mounting substrate, electronic part, and semiconductor device
- Patent Title (中): 电子部件安装基板，电子部件和半导体器件
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Application No.: US10960721Application Date: 2004-10-08
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Publication No.: US06936769B1Publication Date: 2005-08-30
- Inventor: Takashi Noguchi , Masahiro Machida , Makoto Terui , Yuichi Deushi
- Applicant: Takashi Noguchi , Masahiro Machida , Makoto Terui , Yuichi Deushi
- Applicant Address: JP Tokyo
- Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, P.C
- Priority: JP2004-034709 20040212
- Main IPC: H05K3/28
- IPC: H05K3/28 ; H01L23/12 ; H01L23/28 ; H01L23/36 ; H01L23/367 ; H01L23/40 ; H01L23/467 ; H01L23/498 ; H01L23/50 ; H02G3/08 ; H05K1/02 ; H05K1/11 ; H05K1/18 ; H05K3/34 ; H05K5/00
Abstract:
An infrared emissive first insulating portion, which radiates heat transferred from a WCSP corresponding to an electronic part to a first conductive portion as infrared radiation with high efficiency, is formed on the first conductive portion lying in a through hole provided in a printed wiring board with the WCSP mounted thereon.
Public/Granted literature
- US20050178574A1 ELECTRONIC PART MOUNTING SUBSTRATE, ELECTRONIC PART, AND SEMICONDUCTOR DEVICE Public/Granted day:2005-08-18
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