发明授权
- 专利标题: Substrate and fabrication method of the same
- 专利标题(中): 基板及其制造方法相同
-
申请号: US10116204申请日: 2002-04-04
-
公开(公告)号: US06943439B2公开(公告)日: 2005-09-13
- 发明人: Chien-Ping Huang , Han-Ping Pu , Chih-Chin Liao
- 申请人: Chien-Ping Huang , Han-Ping Pu , Chih-Chin Liao
- 申请人地址: TW
- 专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址: TW
- 代理机构: Edwards & Angell, LLP
- 代理商 Peter F. Corless; Steven M. Jensen
- 优先权: TW91101125A 20020124
- 主分类号: H01L21/48
- IPC分类号: H01L21/48 ; H01L23/498 ; H01L23/544 ; H05K1/02 ; H05K3/24 ; H05K3/28 ; H05K3/34 ; H01L23/02 ; H01L23/48 ; H01L23/495 ; H01L23/52 ; H01L29/40
摘要:
A substrate and a fabrication method thereof are proposed, with at least a check point being formed on the substrate. Prior to wire bonding and/or molding processes, cleanness of the substrate (cleaned by plasma) is determined according to color variation of the check point, so as to allow only cleaned and contamination-free substrates to be subsequently formed with bonding wires and encapsulants thereon. Thereby, qualities of wire-bonded electrical connection and encapsulant adhesion for the substrate can be assured, which helps prevent the occurrence of delamination between the encapsulant and the substrate. Moreover, the check point formed on the substrate is made during general substrate fabrication by using current equipment and technique, and in a manner as not to interfere with trace routability on the substrate; thereby, costs and complexity of substrate fabrication would not undesirably increased.
公开/授权文献
- US20030137035A1 Substrate and fabrication method of the same 公开/授权日:2003-07-24