发明授权
US06955264B2 Method of detecting protrusion of inspection object from palette and method of fabricating semiconductor device
失效
从调色板检测检查对象的突起的方法和制造半导体器件的方法
- 专利标题: Method of detecting protrusion of inspection object from palette and method of fabricating semiconductor device
- 专利标题(中): 从调色板检测检查对象的突起的方法和制造半导体器件的方法
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申请号: US10145154申请日: 2002-05-15
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公开(公告)号: US06955264B2公开(公告)日: 2005-10-18
- 发明人: Toshiya Ijichi , Shinji Semba
- 申请人: Toshiya Ijichi , Shinji Semba
- 申请人地址: JP Tokyo
- 专利权人: Renesas Technology Corp.
- 当前专利权人: Renesas Technology Corp.
- 当前专利权人地址: JP Tokyo
- 代理机构: McDermott, Will & Emery
- 优先权: JP2001-217643 20010718
- 主分类号: G01R31/26
- IPC分类号: G01R31/26 ; G01N21/956 ; B07C5/00
摘要:
In order to provide a method of detecting protrusion of an inspection object from a palette improved to be capable of making highly precise detection and reducing a socket breakage ratio, an inspection object is introduced into each of a plurality of pockets provided on the surface of a palette, which in turn is transported. A reflection level of the inspection object stored in each of the plurality of pockets is measured every palette with a reflection type photoelectric sensor. The maximum value and the minimum value of the reflection level are obtained from data of every palette, for calculating a dispersion width defined by the difference between the maximum value and the minimum value. The dispersion width is compared with a previously set determination threshold, for determining whether or not the dispersion width is greater than the determination threshold.
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