公开(公告)号：US06955264B2

公开(公告)日：2005-10-18

申请号：US10145154

申请日：2002-05-15

申请人： Toshiya Ijichi ,  Shinji Semba

发明人： Toshiya Ijichi ,  Shinji Semba

IPC分类号： G01R31/26 ,  G01N21/956 ,  B07C5/00

CPC分类号： G01N21/956

摘要： In order to provide a method of detecting protrusion of an inspection object from a palette improved to be capable of making highly precise detection and reducing a socket breakage ratio, an inspection object is introduced into each of a plurality of pockets provided on the surface of a palette, which in turn is transported. A reflection level of the inspection object stored in each of the plurality of pockets is measured every palette with a reflection type photoelectric sensor. The maximum value and the minimum value of the reflection level are obtained from data of every palette, for calculating a dispersion width defined by the difference between the maximum value and the minimum value. The dispersion width is compared with a previously set determination threshold, for determining whether or not the dispersion width is greater than the determination threshold.

摘要翻译： 为了提供一种检测检查对象从调色板突出的方法，其能够进行高精度检测和减小插座断裂率，将检查对象引入到设置在 调色板，反过来被运输。 每个调色板用反射型光电传感器测量存储在多个凹穴中的每一个中的检查对象的反射水平。 从每个调色板的数据获得反射电平的最大值和最小值，用于计算由最大值和最小值之间的差定义的色散宽度。 将色散宽度与先前设置的确定阈值进行比较，以确定色散宽度是否大于确定阈值。

公开(公告)号：US06738503B1

公开(公告)日：2004-05-18

申请号：US09628659

申请日：2000-07-28

申请人： Yoshikazu Sakaue ,  Toshiya Ijichi

发明人： Yoshikazu Sakaue ,  Toshiya Ijichi

IPC分类号： G06K900

CPC分类号： G06T7/0008 ,  G06T7/74 ,  G06T2207/30148

摘要： A notch inspection method based on shading pattern matching for inspecting notches on semiconductor packages or like objects. A template is created to characteristically express brightness gradations of a notch edge in a picture, i.e., to represent the notch edge in pixels constituting contiguous bright and dark portions of the edge. The template may be created on the basis of notch size information or notch size measurements. The template is checked against pictures under inspection in shading pattern matching whereby presence of a notch is determined. Computations of shading pattern matching are omitted regarding portions of the notch edge where brightness remains unchanged.

摘要翻译： 基于用于检查半导体封装或类似物体上的凹口的阴影图案匹配的切口检查方法。 创建模板以特征地表示图像中的切口边缘的亮度等级，即表示构成边缘的连续明暗部分的像素的切口边缘。 可以基于凹口尺寸信息或凹口尺寸测量来创建模板。 根据检查中的图片检查模板，以确定存在凹口的阴影图案匹配。 关于亮度保持不变的凹口边缘的部分省略阴影图案匹配的计算。

公开(公告)号：US06804387B1

公开(公告)日：2004-10-12

申请号：US09628275

申请日：2000-07-28

申请人： Yoshikazu Sakaue ,  Toshiya Ijichi

发明人： Yoshikazu Sakaue ,  Toshiya Ijichi

IPC分类号： G06K900

CPC分类号： G06K9/6203

摘要： A pattern matching method comprising the steps of: computing matching scores while shifting a template picture in increments of four pixels so as to find a pixel corresponding to a maximum matching score; performing, starting from the pixel of the maximum matching score obtained in the matching score computing step, matching computations on each of an upper, a lower, a left-hand and a right-hand pixel surrounding the starting pixel in order to reach a pixel having a higher matching score than any other surrounding pixel; coming to a stop when the pixel with the highest matching score is reached; and adding to the highest matching score obtained in the computation performing step a correction value which takes into account the matching scores of the pixels adjacent to the highest matching score pixel, whereby matching score allowances due to dislocated pixels are corrected.

摘要翻译： 一种图案匹配方法，包括以下步骤：在以四个像素为增量移动模板图像的同时计算匹配分数，以找到与最大匹配分数对应的像素; 从匹配得分计算步骤中获得的最大匹配分数的像素开始，对起始像素周围的上，下，左和右像素中的每一个进行匹配计算，以便到达像素 具有比任何其他周围像素更高的匹配分数; 当达到最高匹配分数的像素时停止; 并且将在计算执行步骤中获得的最高匹配分数加上考虑了与最高匹配分数像素相邻的像素的匹配分数的校正值，从而校正由位错像素引起的匹配分数限制。

公开(公告)号：US5384531A

公开(公告)日：1995-01-24

申请号：US940838

申请日：1992-09-04

申请人： Mitsuru Yamazaki ,  Masakazu Yashiro ,  Toshiya Ijichi

发明人： Mitsuru Yamazaki ,  Masakazu Yashiro ,  Toshiya Ijichi

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R31/311 ,  H01L21/66 ,  G01R1/06

CPC分类号： G01R31/2893 ,  G01R31/2851 ,  G01R31/2887 ,  G01R31/311

摘要： An apparatus for inspecting characteristics of semiconductor chips has a loading device for loading semiconductor chips onto a testing tray positioned by a servo motor, a CCD camera, an upper contact fixture controlled in X, Y, and .THETA. directions, and a lower contacting fixture driven by a cylinder. Positioning of the contact probe pins is accurately achieved by pattern processing and fully automated inspection is made possible. The apparatus is equipped with the same number of contact probe pins as the number of inspection points of a semiconductor chip; hence, all the cells of a semiconductor chip can be inspected as a unit. Therefore, the inspection can be made in a mode similar to practical conditions that occur after final assembly of the semiconductor chip.

摘要翻译： 用于检查半导体芯片的特性的装置具有用于将半导体芯片装载到由伺服电机，CCD照相机，以X，Y和THETA方向控制的上接触夹具定位的测试托盘上的加载装置，以及下接触夹具驱动 通过圆柱体。 通过图案处理可精确地实现接触式探针的定位，并实现全自动检查。 该装置配备有与半导体芯片的检查点数相同数量的接触探针， 因此，可以将半导体芯片的所有单元视为一个单元。 因此，可以以与半导体芯片的最终组装之后发生的实际条件相似的模式进行检查。