Invention Grant
- Patent Title: Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same
- Patent Title (中): 在铜线接合衬底上使用直接金表面光洁度，制作方法和测试方法
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Application No.: US10608059Application Date: 2003-06-27
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Publication No.: US06972152B2Publication Date: 2005-12-06
- Inventor: Brian Taggert , Dale Hackitt , Dilip K. Misra
- Applicant: Brian Taggert , Dale Hackitt , Dilip K. Misra
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg, Woessner & Kluth, P.A.
- Main IPC: C23C28/02
- IPC: C23C28/02 ; C23C30/00 ; H01L23/498 ; H05K3/24 ; H05K3/34 ; B32B9/00 ; H01L23/48
Abstract:
A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.
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