Invention Grant
US06972152B2 Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same 失效
在铜线接合衬底上使用直接金表面光洁度,制作方法和测试方法

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same
Abstract:
A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.
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