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US06974982B2 Method of manufacturing semiconductor device and semiconductor device 失效
制造半导体器件和半导体器件的方法

Method of manufacturing semiconductor device and semiconductor device
Abstract:
Impurity ions are implanted into the silicon layer of an SOI substrate to achieve an ion concentration distribution which inhibits for a reduction in threshold voltage (Vth-rolloff) as a gate length is reduced. A reduction in potential barrier which runs from a drain region side is effectively inhibited to counter short channel effects resulting from a reduction in gate length attendant with miniaturization of SOI-MOSFETs.
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