Invention Grant
- Patent Title: Method of manufacturing semiconductor device and semiconductor device
- Patent Title (中): 制造半导体器件和半导体器件的方法
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Application No.: US10913430Application Date: 2004-08-09
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Publication No.: US06974982B2Publication Date: 2005-12-13
- Inventor: Noriyuki Miura
- Applicant: Noriyuki Miura
- Applicant Address: JP Tokyo
- Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volentine Francos & Whitt, PLLC
- Priority: JP2001-068895 20010312
- Main IPC: H01L27/08
- IPC: H01L27/08 ; H01L21/265 ; H01L21/336 ; H01L21/762 ; H01L21/8238 ; H01L27/092 ; H01L29/786 ; H01L29/76

Abstract:
Impurity ions are implanted into the silicon layer of an SOI substrate to achieve an ion concentration distribution which inhibits for a reduction in threshold voltage (Vth-rolloff) as a gate length is reduced. A reduction in potential barrier which runs from a drain region side is effectively inhibited to counter short channel effects resulting from a reduction in gate length attendant with miniaturization of SOI-MOSFETs.
Public/Granted literature
- US20050014336A1 Method of manufacturing semiconductor device and semiconductor device Public/Granted day:2005-01-20
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