发明授权
- 专利标题： Capacitance sensing for substrate cooling
- 专利标题（中）： 电容传感用于衬底冷却
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申请号： US10845702申请日： 2004-05-14
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公开(公告)号： US07000418B2公开(公告)日： 2006-02-21
- 发明人: James H. Rogers , Brian Hoffman
- 申请人： James H. Rogers , Brian Hoffman
- 申请人地址： US CA Santa Clara
- 专利权人： Intevac, Inc.
- 当前专利权人： Intevac, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理商 Stanley Z. Cole
- 主分类号： F25D23/12
- IPC分类号： F25D23/12 ; F28F7/00 ; F28F5/00 ; C23C16/00 ; C23C13/00
摘要：
Described is a cooling system for use in the manufacture of substrates into magnetic disk memory in which cooling plates are positioned dynamically in relation to a substrate to be cooled. This enables positioning the cooling plates closer for more effective cooling. Positioning is controlled by capacitive measurements between the cooling plates and the substrate to be cooled.
公开/授权文献
- US20050252227A1 Capacitance sensing for substrate cooling 公开/授权日：2005-11-17
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