发明授权
US07023027B2 Diode package having an anode and a cathode formed on one surface of a diode chip
有权
具有在二极管芯片的一个表面上形成的阳极和阴极的二极管封装
- 专利标题： Diode package having an anode and a cathode formed on one surface of a diode chip
- 专利标题（中）： 具有在二极管芯片的一个表面上形成的阳极和阴极的二极管封装
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申请号： US10294619申请日： 2002-11-15
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公开(公告)号： US07023027B2公开(公告)日： 2006-04-04
- 发明人: Toshiya Teramae , Junichi Saeki , Yasuharu Ichinose , Shuichi Suzuki
- 申请人： Toshiya Teramae , Junichi Saeki , Yasuharu Ichinose , Shuichi Suzuki
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout and Kraus, LLP.
- 优先权： JP2001-357775 20011122
- 主分类号： H01L29/861
- IPC分类号： H01L29/861 ; H01L29/88
摘要：
A small semiconductor package having two electrodes, which can be produced at reduced cost and which features high reliability. The package has a structure in which an anode and a cathode are arranged on one surface of a semiconductor chip, each electrode having a bump electrode for connecting the electrode to an external substrate. An insulating resin is provided on the surface of the semiconductor chip and on the surfaces of the bump electrodes, except at least for the connection portions to the external substrate.
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