Invention Grant
- Patent Title: Heat spreader and stiffener having a stiffener extension
- Patent Title (中): 具有加强筋延伸的散热器和加强件
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Application No.: US09964494Application Date: 2001-09-28
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Publication No.: US07045890B2Publication Date: 2006-05-16
- Inventor: Hong Xie , Kristopher Frutschy , Koushik Banerjee , Ajit Sathe
- Applicant: Hong Xie , Kristopher Frutschy , Koushik Banerjee , Ajit Sathe
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg, Woessner & Kluth, P.A.
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K7/20 ; H01L23/34 ; H01L23/367 ; H01L23/12
Abstract:
A heat spreader and stiffener device has a stiffener portion extending towards a center of the heat spreader and stiffener device and mountable to a die-side surface of a substrate.
Public/Granted literature
- US20030062618A1 Arrangements to increase structural rigidity of semiconductor package Public/Granted day:2003-04-03
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