Invention Grant
US07049837B2 Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
失效
探头片，探针卡，半导体测试设备和半导体器件制造方法
- Patent Title: Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
- Patent Title (中): 探头片，探针卡，半导体测试设备和半导体器件制造方法
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Application No.: US10676609Application Date: 2003-10-02
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Publication No.: US07049837B2Publication Date: 2006-05-23
- Inventor: Susumu Kasukabe , Takehiko Hasebe , Yasunori Narizuka , Akio Hasebe
- Applicant: Susumu Kasukabe , Takehiko Hasebe , Yasunori Narizuka , Akio Hasebe
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout and Kraus, LLP.
- Priority: JP2002-289377 20021002
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
A probe card has first contact terminals electrically connected to the fine-pitch electrodes of a test target; wirings drawn from the first contact terminals; and second contact terminals electrically connected to the wirings, wherein the first contact terminals are formed each using an anisotropically etched hole in a crystalline substrate, and a semiconductor device test method (fabrication method) using the probe card.
Public/Granted literature
- US20040070413A1 Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method Public/Granted day:2004-04-15
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