发明授权
US07060534B2 Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins 失效
用于半导体器件的壳体,半导体器件引脚和用于制造引脚的方法

Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins
摘要:
A housing, in particular for semiconductor devices, a semiconductor device pin, and a method for the manufacturing of pins wherein at least one pin is punched out from a basic body, in particular a lead framed, by means of one or a plurality of punching process steps, wherein the pin is coated with a separate metal layer after the final punching out of said pin.
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