发明授权
US07060534B2 Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins
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用于半导体器件的壳体,半导体器件引脚和用于制造引脚的方法
- 专利标题: Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins
- 专利标题(中): 用于半导体器件的壳体,半导体器件引脚和用于制造引脚的方法
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申请号: US10757549申请日: 2004-01-15
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公开(公告)号: US07060534B2公开(公告)日: 2006-06-13
- 发明人: Manfred Dobler , Georg Erhard Eggers , Christian Stocken
- 申请人: Manfred Dobler , Georg Erhard Eggers , Christian Stocken
- 申请人地址: DE Munich
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Munich
- 代理机构: Morrison & Foerster LLP
- 优先权: DE10301480 20030116
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
A housing, in particular for semiconductor devices, a semiconductor device pin, and a method for the manufacturing of pins wherein at least one pin is punched out from a basic body, in particular a lead framed, by means of one or a plurality of punching process steps, wherein the pin is coated with a separate metal layer after the final punching out of said pin.
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