发明授权
US07102376B2 Power semiconductor module with detector for detecting main circuit current through power semiconductor element
有权
功率半导体模块,带检测器,用于通过功率半导体元件检测主电路电流
- 专利标题: Power semiconductor module with detector for detecting main circuit current through power semiconductor element
- 专利标题(中): 功率半导体模块,带检测器,用于通过功率半导体元件检测主电路电流
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申请号: US10846546申请日: 2004-05-17
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公开(公告)号: US07102376B2公开(公告)日: 2006-09-05
- 发明人: Toru Iwagami , Shinya Shirakawa , Mamoru Seo , Masaki Sakai , Dong Wang
- 申请人: Toru Iwagami , Shinya Shirakawa , Mamoru Seo , Masaki Sakai , Dong Wang
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2003-273300 20030711
- 主分类号: G01R31/26
- IPC分类号: G01R31/26
摘要:
A power semiconductor module has a detector for detecting main circuit current passing through a power semiconductor element. The detector includes first and second circuit patterns; a bonding wire connected at first and second bonding points with the first and second circuit patterns, respectively; and a pair of terminal patterns extended from near the first and second bonding points of the first and second circuit patterns. The detector is designed to detect a potential difference between the pair of terminal patterns generated by flowing main circuit current through the first circuit pattern, the bonding wire and then the second circuit pattern, in order to detect a potential difference across the bonding wire.