Invention Grant
- Patent Title: Multi-structured Si-fin
- Patent Title (中): 多结构Si-fin
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Application No.: US10778147Application Date: 2004-02-17
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Publication No.: US07141856B2Publication Date: 2006-11-28
- Inventor: Deok Hyung Lee , Byeong Chan Lee , In Soo Jung , Yong Hoon Son , Siyoung Choi , Taek Jung Kim
- Applicant: Deok Hyung Lee , Byeong Chan Lee , In Soo Jung , Yong Hoon Son , Siyoung Choi , Taek Jung Kim
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce
- Priority: KR10-2003-0056636 20030814
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
Disclosed is a semiconductor fin construction useful in FinFET devices that incorporates an upper region and a lower region with wherein the upper region is formed with substantially vertical sidewalls and the lower region is formed with inclined sidewalls to produce a wider base portion. The disclosed semiconductor fin construction will also typically include a horizontal step region at the interface between the upper region and the lower region. Also disclosed are a series of methods of manufacturing semiconductor devices incorporating semiconductor fins having this dual construction and incorporating various combinations of insulating materials such as silicon dioxide and/or silicon nitride for forming shallow trench isolation (STI) structures between adjacent semiconductor fins.
Public/Granted literature
- US20050035391A1 Multi-structured Si-fin and method of manufacture Public/Granted day:2005-02-17
Information query
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