摘要:
Provided are a method of forming an insulating layer and a method of manufacturing a transistor using the method. The method of forming the insulating layer includes forming a preliminary insulating layer including silicon oxide (SiO2) on a silicon (Si)-containing substrate. A reactive gas containing ammonia (NH3) gas is supplied to the preliminary insulating layer. Nitrogen radicals (N*) and hydrogen radicals (H*) are generated from the ammonia gas using plasma. The hydrogen radicals combine with oxygen of the preliminary insulating layer, and the nitrogen radicals combine with the silicon oxide so that an insulating layer including hydroxides (OH) and silicon oxynitride (SiON) can be formed.
摘要:
A semiconductor device includes an inorganic insulating layer on a semiconductor substrate, a contact plug that extends through the inorganic insulating layer to contact the semiconductor substrate and a stress buffer spacer disposed between the node contact plug and the inorganic insulating layer. The device further includes a thin-film transistor (TFT) disposed on the inorganic insulating layer and having a source/drain region extending along the inorganic insulating layer to contact the contact plug. The device may further include an etch stop layer interposed between the inorganic insulating layer and the semiconductor substrate.
摘要:
A NAND-type flash memory device including selection transistors is provided. The device includes first and second impurity regions formed in a semiconductor substrate, and first and second selection gate patterns disposed on the semiconductor substrate between the first and second impurity regions. The first and second selection gate patterns are disposed adjacent to the first and second impurity regions, respectively. A plurality of cell gate patterns are disposed between the first and second selection gate patterns. A first anti-punchthrough impurity region that surrounds the first impurity region is provided in the semiconductor substrate. The first anti-punchthrough impurity region overlaps with a first edge of the first selection gate pattern adjacent to the first impurity region. A second anti-punchthrough impurity region that surrounds the second impurity region is provided in the semiconductor substrate. The second anti-punchthrough impurity region overlaps with a first edge of the second selection gate pattern adjacent to the second impurity region.
摘要:
Metal-oxide-semiconductor (MOS) transistors having elevated source/drain regions and methods of fabricating the same are provided. The MOS transistors may include a gate pattern formed to cross over a predetermined region of a substrate. Recessed regions are provided in the substrate adjacent to the gate pattern. Epitaxial layers are provided on bottom surfaces of the recessed regions. High concentration impurity regions are provided in the epitaxial layers. The recessed regions may be formed using a chemical dry etching techniques.
摘要:
A method of forming a fin field effect transistor on a semiconductor substrate includes forming an active region in the substrate, forming an epitaxial layer on the active region, and removing a portion of the epitaxial layer to form a vertical fin on the active region. The fin has a width that is narrower than a width of the active region. Removing a portion of the epitaxial layer may include oxidizing a surface of the epitaxial layer and then removing the oxidized surface of the epitaxial layer to decrease the width of the fin. The epitaxial layer may be doped in situ before removing a portion of the epitaxial layer. The method further includes forming a conductive layer on a top surface and on sidewalls of the fin. Related transistors are also discussed.
摘要:
A FinFET may include a semiconductor fin having a top surface and a sidewall having different crystal planes. A gate dielectric layer on the top surface and on the sidewall has different thicknesses. A gate electrode is formed on the gate dielectric layer across the top surface and sidewall of the semiconductor fin.
摘要:
Semiconductor devices have gate structures on a semiconductor substrate with first spacers on sidewalls of the respective gate structures. First contact pads are positioned between the gate structures and have heights lower than the heights of the gate structures. Second spacers are disposed on sidewalls of the first spacers and on exposed sidewalls of the first contact pads. Second contact pads are disposed on the first contact pads.
摘要:
Semiconductor devices have gate structures on a semiconductor substrate with first spacers on sidewalls of the respective gate structures. First contact pads are positioned between the gate structures and have heights lower than the heights of the gate structures. Second spacers are disposed on sidewalls of the first spacers and on exposed sidewalls of the first contact pads. Second contact pads are disposed on the first contact pads.
摘要:
A fin field effect transistor (FinFET) includes a first gate and a second gate. The first gate has a vertical part that is defined by sidewalls of a silicon fin and sidewalls of a capping pattern disposed on the silicon fin and a horizontal part horizontally extends from the vertical part. The second gate is made of a low-resistivity material and is in direct contact with the horizontal part of the first gate. A channel may be controlled due to the first gate, and a device operating speed may be enhanced due to the second gate. Related fabrication methods also are described.
摘要:
A method of forming a fin field effect transistor on a semiconductor substrate includes forming an active region in the substrate, forming an epitaxial layer on the active region, and removing a portion of the epitaxial layer to form a vertical fin on the active region. The fin has a width that is narrower than a width of the active region. Removing a portion of the epitaxial layer may include oxidizing a surface of the epitaxial layer and then removing the oxidized surface of the epitaxial layer to decrease the width of the fin. The epitaxial layer may be doped in situ before removing a portion of the epitaxial layer. The method further includes forming a conductive layer on a top surface and on sidewalls of the fin. Related transistors are also discussed.