发明授权
US07151014B2 Underfilling process in a molded matrix array package using flow front modifying solder resist
失效
使用流动前修饰阻焊剂的模压矩阵阵列封装中的底部填充工艺
- 专利标题: Underfilling process in a molded matrix array package using flow front modifying solder resist
- 专利标题(中): 使用流动前修饰阻焊剂的模压矩阵阵列封装中的底部填充工艺
-
申请号: US10774155申请日: 2004-02-05
-
公开(公告)号: US07151014B2公开(公告)日: 2006-12-19
- 发明人: Rahul N. Manepalli , Saravanan Krishnan , Choong Kooi Chee
- 申请人: Rahul N. Manepalli , Saravanan Krishnan , Choong Kooi Chee
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L23/31
- IPC分类号: H01L23/31
摘要:
Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By separating the top flow front and the bottom flow front, this process prevents the top flow front from wrapping around the sides of the substrates and trapping air below each substrate and in front of the bottom flow front.
公开/授权文献
信息查询
IPC分类: