发明授权
US07151014B2 Underfilling process in a molded matrix array package using flow front modifying solder resist 失效
使用流动前修饰阻焊剂的模压矩阵阵列封装中的底部填充工艺

Underfilling process in a molded matrix array package using flow front modifying solder resist
摘要:
Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By separating the top flow front and the bottom flow front, this process prevents the top flow front from wrapping around the sides of the substrates and trapping air below each substrate and in front of the bottom flow front.
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