Invention Grant
- Patent Title: Materials and method to seal vias in silicon substrates
- Patent Title (中): 在硅衬底中密封通孔的材料和方法
-
Application No.: US10908480Application Date: 2005-05-13
-
Publication No.: US07199450B2Publication Date: 2007-04-03
- Inventor: Jon A. Casey , Michael Berger , Leena P. Buchwalter , Donald F. Canaperi , Raymond R. Horton , Anurag Jain , Eric D. Perfecto , James A. Tornello
- Applicant: Jon A. Casey , Michael Berger , Leena P. Buchwalter , Donald F. Canaperi , Raymond R. Horton , Anurag Jain , Eric D. Perfecto , James A. Tornello
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: DeLio & Peterson, LLC
- Agent Robert Curcio; Ira D. Blecker
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L23/58

Abstract:
Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via at an elevated temperature. A supply chamber is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.
Public/Granted literature
- US20060255480A1 MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES Public/Granted day:2006-11-16
Information query
IPC分类: