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US07199450B2 Materials and method to seal vias in silicon substrates 有权
在硅衬底中密封通孔的材料和方法

Materials and method to seal vias in silicon substrates
摘要:
Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via at an elevated temperature. A supply chamber is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.
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