发明授权
- 专利标题: Materials and method to seal vias in silicon substrates
- 专利标题(中): 在硅衬底中密封通孔的材料和方法
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申请号: US10908480申请日: 2005-05-13
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公开(公告)号: US07199450B2公开(公告)日: 2007-04-03
- 发明人: Jon A. Casey , Michael Berger , Leena P. Buchwalter , Donald F. Canaperi , Raymond R. Horton , Anurag Jain , Eric D. Perfecto , James A. Tornello
- 申请人: Jon A. Casey , Michael Berger , Leena P. Buchwalter , Donald F. Canaperi , Raymond R. Horton , Anurag Jain , Eric D. Perfecto , James A. Tornello
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: DeLio & Peterson, LLC
- 代理商 Robert Curcio; Ira D. Blecker
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L23/58
摘要:
Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via at an elevated temperature. A supply chamber is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.
公开/授权文献
- US20060255480A1 MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES 公开/授权日:2006-11-16
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