发明授权
- 专利标题： Package warpage control
- 专利标题（中）： 包装翘曲控制
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申请号： US10856371申请日： 2004-05-27
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公开(公告)号： US07208342B2公开(公告)日： 2007-04-24
- 发明人: Michael Keat Lye Lee , Mun Leong Loke , Soon Chuan Ong , Hooi Jin Teng , Lisa Yung Hui Lee , Altaf Hasan
- 申请人： Michael Keat Lye Lee , Mun Leong Loke , Soon Chuan Ong , Hooi Jin Teng , Lisa Yung Hui Lee , Altaf Hasan
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Marger Johnson & McCollom, P.C.
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L23/12 ; H01L23/40
摘要：
A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
公开/授权文献
- US20050266607A1 Package warpage control 公开/授权日：2005-12-01
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