发明授权
- 专利标题: Power module package having improved heat dissipating capability
- 专利标题(中): 功率模块封装具有改善的散热能力
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申请号: US10974357申请日: 2004-10-26
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公开(公告)号: US07208819B2公开(公告)日: 2007-04-24
- 发明人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
- 申请人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
- 申请人地址: KR
- 专利权人: Fairchild Korea Semiconductor Ltd.
- 当前专利权人: Fairchild Korea Semiconductor Ltd.
- 当前专利权人地址: KR
- 代理机构: Townsend and Townsend and Crew LLP
- 优先权: KR2001-32489 20010611; KR2002-20779 20020417
- 主分类号: H01L23/495
- IPC分类号: H01L23/495
摘要:
A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.