-
公开(公告)号:US20050056918A1
公开(公告)日:2005-03-17
申请号:US10974357
申请日:2004-10-26
申请人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号: H01L21/56 , H01L23/433 , H01L23/495
CPC分类号: H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
摘要翻译: 提供电源模块封装。 功率模块封装包括电源电路元件,控制电路元件,引线框架,散热器和环氧树脂模塑料(EMC)。 控制电路元件连接到电源电路并控制电源电路中的芯片。 引线框架具有形成在其边缘处的外部连接装置和形成在外部连接装置之间的下降部分。 引线框架具有安装电源电路和控制电路的第一表面,并且用作散热路径的第二表面,特别地,电源电路附接到下降部件。 通过粘合剂紧密地附接到引线框架的第二表面的下降部分的散热器。 EMC围绕电源电路,控制电路,引线框架和散热器,并将引线框架的外部连接装置和散热片的一侧曝光。
-
公开(公告)号:US07061080B2
公开(公告)日:2006-06-13
申请号:US10167067
申请日:2002-06-10
申请人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号: H01L23/495
CPC分类号: H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
-
公开(公告)号:US07208819B2
公开(公告)日:2007-04-24
申请号:US10974357
申请日:2004-10-26
申请人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号: H01L23/495
CPC分类号: H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
摘要翻译: 提供电源模块封装。 功率模块封装包括电源电路元件,控制电路元件,引线框架,散热器和环氧树脂模塑料(EMC)。 控制电路元件连接到电源电路并控制电源电路中的芯片。 引线框架具有形成在其边缘处的外部连接装置和形成在外部连接装置之间的下降部分。 引线框架具有安装电源电路和控制电路的第一表面,并且用作散热路径的第二表面,特别地,电源电路附接到下降部件。 通过粘合剂紧密地附接到引线框架的第二表面的下降部分的散热器。 EMC围绕电源电路,控制电路,引线框架和散热器,并将引线框架的外部连接装置和散热片的一侧曝光。
-
公开(公告)号:US07800224B2
公开(公告)日:2010-09-21
申请号:US11965983
申请日:2007-12-28
申请人: Joo-sang Lee , O-seob Jeon , Yong-suk Kwon , Frank Chen , Adams Zhu
发明人: Joo-sang Lee , O-seob Jeon , Yong-suk Kwon , Frank Chen , Adams Zhu
IPC分类号: H01L23/495
CPC分类号: H01L23/49575 , H01L23/49531 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.
摘要翻译: 根据本发明的一个实施例的功率器件封装包括布置在绝缘衬底上的布线图案的绝缘衬底。 互连图案包括包括第一金属层的单个导电层和包括另一第一金属层和设置在另一第一金属层上的第二金属层的多导电层。 多个导线附着到单个导电层的上表面和/或多导电层的第二金属层的上表面。 驱动功率控制半导体芯片的功率控制半导体芯片和低功率半导体芯片上的接触焊盘电连接到导线。
-
公开(公告)号:US20080157310A1
公开(公告)日:2008-07-03
申请号:US11965983
申请日:2007-12-28
申请人: Joo-sang Lee , O-seob Jeon , Yong-suk Kwon , Frank Chen , Adams Zhu
发明人: Joo-sang Lee , O-seob Jeon , Yong-suk Kwon , Frank Chen , Adams Zhu
IPC分类号: H01L23/495
CPC分类号: H01L23/49575 , H01L23/49531 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.
摘要翻译: 根据本发明的一个实施例的功率器件封装包括布置在绝缘衬底上的布线图案的绝缘衬底。 互连图案包括包括第一金属层的单个导电层和包括另一第一金属层和设置在另一第一金属层上的第二金属层的多导电层。 多个导线附着到单个导电层的上表面和/或多导电层的第二金属层的上表面。 驱动功率控制半导体芯片的功率控制半导体芯片和低功率半导体芯片上的接触焊盘电连接到导线。
-
-
-
-