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公开(公告)号:US07061080B2
公开(公告)日:2006-06-13
申请号:US10167067
申请日:2002-06-10
申请人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号: H01L23/495
CPC分类号: H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
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公开(公告)号:US20050056918A1
公开(公告)日:2005-03-17
申请号:US10974357
申请日:2004-10-26
申请人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号: H01L21/56 , H01L23/433 , H01L23/495
CPC分类号: H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
摘要翻译: 提供电源模块封装。 功率模块封装包括电源电路元件,控制电路元件,引线框架,散热器和环氧树脂模塑料(EMC)。 控制电路元件连接到电源电路并控制电源电路中的芯片。 引线框架具有形成在其边缘处的外部连接装置和形成在外部连接装置之间的下降部分。 引线框架具有安装电源电路和控制电路的第一表面,并且用作散热路径的第二表面,特别地,电源电路附接到下降部件。 通过粘合剂紧密地附接到引线框架的第二表面的下降部分的散热器。 EMC围绕电源电路,控制电路,引线框架和散热器,并将引线框架的外部连接装置和散热片的一侧曝光。
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公开(公告)号:US07208819B2
公开(公告)日:2007-04-24
申请号:US10974357
申请日:2004-10-26
申请人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号: H01L23/495
CPC分类号: H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
摘要翻译: 提供电源模块封装。 功率模块封装包括电源电路元件,控制电路元件,引线框架,散热器和环氧树脂模塑料(EMC)。 控制电路元件连接到电源电路并控制电源电路中的芯片。 引线框架具有形成在其边缘处的外部连接装置和形成在外部连接装置之间的下降部分。 引线框架具有安装电源电路和控制电路的第一表面,并且用作散热路径的第二表面,特别地,电源电路附接到下降部件。 通过粘合剂紧密地附接到引线框架的第二表面的下降部分的散热器。 EMC围绕电源电路,控制电路,引线框架和散热器,并将引线框架的外部连接装置和散热片的一侧曝光。
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