发明授权
US07258598B2 Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device
失效
抛光溶液供给系统，抛光溶液的供给方法，半导体基板的研磨装置及其研磨方法以及半导体装置的制造方法
- 专利标题： Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device
- 专利标题（中）： 抛光溶液供给系统，抛光溶液的供给方法，半导体基板的研磨装置及其研磨方法以及半导体装置的制造方法
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申请号： US09934474申请日： 2001-08-23
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公开(公告)号： US07258598B2公开(公告)日： 2007-08-21
- 发明人: Masanobu Iwasaki , Yoshio Hayashide
- 申请人： Masanobu Iwasaki , Yoshio Hayashide
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2000-363478 20001129
- 主分类号： B24B1/00
- IPC分类号： B24B1/00 ; B24B5/00
摘要：
A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of abrasive slurry, the mist of additive and the mist of pure water to prepare polishing solution, and supplies the polishing solution onto the major surface of a polishing stage.