发明授权
US07275815B2 Die attach methods and apparatus for micro-fluid ejection device 有权
微流体喷射装置的贴片方法和装置

Die attach methods and apparatus for micro-fluid ejection device
摘要:
A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The micro-fluid ejection device structure includes a fluid supply body containing at least three fluid supply slots therein. An ejection head substrate having fluid feed slots therein is attached to the fluid supply body. Each of the fluid supply slots in the body is in flow communication with at least one of the fluid feed slots in the substrate. A plurality of adhesive bond lines adhesively attach the ejection head substrate and the fluid supply body to one another. Each of the adhesive bond lines have a width of less than about 600 microns and are located between adjacent ones of the fluid supply slots in the body.
信息查询
0/0