发明授权
- 专利标题: Die attach methods and apparatus for micro-fluid ejection device
- 专利标题(中): 微流体喷射装置的贴片方法和装置
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申请号: US11000763申请日: 2004-12-01
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公开(公告)号: US07275815B2公开(公告)日: 2007-10-02
- 发明人: Craig M. Bertelsen , Kin M. Kwan , Sean T. Weaver
- 申请人: Craig M. Bertelsen , Kin M. Kwan , Sean T. Weaver
- 申请人地址: US KY Lexington
- 专利权人: Lexmark International, Inc.
- 当前专利权人: Lexmark International, Inc.
- 当前专利权人地址: US KY Lexington
- 代理机构: Luedeka, Neely & Graham, PC
- 主分类号: B41J2/175
- IPC分类号: B41J2/175
摘要:
A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The micro-fluid ejection device structure includes a fluid supply body containing at least three fluid supply slots therein. An ejection head substrate having fluid feed slots therein is attached to the fluid supply body. Each of the fluid supply slots in the body is in flow communication with at least one of the fluid feed slots in the substrate. A plurality of adhesive bond lines adhesively attach the ejection head substrate and the fluid supply body to one another. Each of the adhesive bond lines have a width of less than about 600 microns and are located between adjacent ones of the fluid supply slots in the body.
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