Die attach methods and apparatus for micro-fluid ejection device
    1.
    发明授权
    Die attach methods and apparatus for micro-fluid ejection device 有权
    微流体喷射装置的贴片方法和装置

    公开(公告)号:US07275815B2

    公开(公告)日:2007-10-02

    申请号:US11000763

    申请日:2004-12-01

    IPC分类号: B41J2/175

    CPC分类号: B41J2/1753 B41J2/17513

    摘要: A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The micro-fluid ejection device structure includes a fluid supply body containing at least three fluid supply slots therein. An ejection head substrate having fluid feed slots therein is attached to the fluid supply body. Each of the fluid supply slots in the body is in flow communication with at least one of the fluid feed slots in the substrate. A plurality of adhesive bond lines adhesively attach the ejection head substrate and the fluid supply body to one another. Each of the adhesive bond lines have a width of less than about 600 microns and are located between adjacent ones of the fluid supply slots in the body.

    摘要翻译: 微流体喷射装置结构,包含喷射装置结构的多流体盒,以及用于制造喷射装置结构和盒的方法。 微流体喷射装置结构包括其中包含至少三个流体供应槽的流体供应主体。 其中具有流体供给槽的喷射头基板附接到流体供应体。 身体中的每个流体供应槽与衬底中的至少一个流体供给槽流动连通。 多个粘合剂粘合线将喷射头基板和流体供给体彼此粘合地附接。 每个粘合剂粘合线具有小于约600微米的宽度,并且位于身体中相邻的流体供应槽之间。