Invention Grant
- Patent Title: Integrated electronic circuit comprising superposed components
- Patent Title (中): 集成电子电路包括重叠的部件
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Application No.: US11412270Application Date: 2006-04-27
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Publication No.: US07378692B2Publication Date: 2008-05-27
- Inventor: Philippe Delpech , Christophe Regnier , Sebastien Cremer , Stephane Monfray
- Applicant: Philippe Delpech , Christophe Regnier , Sebastien Cremer , Stephane Monfray
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics SA
- Current Assignee: STMicroelectronics SA
- Current Assignee Address: FR Montrouge
- Agency: Fleit Kain Gibbons Gutman Bongini & Bianco P.L.
- Agent Lisa K. Jorgenson; Jon A. Gibbons
- Priority: FR0306030 20030520
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119
Abstract:
An integrated electronic circuit with at least at least one passive electronic component and at least one active electronic component. The passive electronic component is formed within an insulating material disposed on a substrate. The active component is formed within a volume of substantially single-crystal semiconductor material disposed on top of the passive component.
Public/Granted literature
- US20060189057A1 Integrated electronic circuit comprising superposed components Public/Granted day:2006-08-24
Information query
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