发明授权
US07423439B2 Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
失效
探针片粘合保持器，探针卡，半导体测试装置和半导体器件的制造方法
- 专利标题： Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
- 专利标题（中）： 探针片粘合保持器，探针卡，半导体测试装置和半导体器件的制造方法
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申请号： US11543021申请日： 2006-10-05
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公开(公告)号： US07423439B2公开(公告)日： 2008-09-09
- 发明人: Susumu Kasukabe , Teruo Shoji , Akio Hasebe , Yoshinori Deguchi , Yasunori Narizuka
- 申请人： Susumu Kasukabe , Teruo Shoji , Akio Hasebe , Yoshinori Deguchi , Yasunori Narizuka
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2005-291886 20051005
- 主分类号： G01R31/02
- IPC分类号： G01R31/02
摘要：
In a prove card comprising: a probe sheet having a contact terminal contacting with an electrode provided on a wafer, a wiring led from the contact terminal, and an electrode electrically connected to the wiring; and a multilayered wiring substrate having an electrode electrically connected to the electrode of the probe sheet, wherein a contact between the contact terminal and the electrode of the wafer is established by one or more adhesion holder for pressing, from the backside of a terminal group of the terminal contacts, the terminal group via a press block with a spring to contact with the electrode pad. A device in which the probe sheet is attached to the adhesion holder and a plurality of chips are tested simultaneously by combining the adhesion holder.