Invention Grant
- Patent Title: Temperature determination and communication for multiple devices of a memory module
- Patent Title (中): 存储器模块的多个器件的温度测定和通信
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Application No.: US11801909Application Date: 2007-05-10
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Publication No.: US07450456B2Publication Date: 2008-11-11
- Inventor: Sandeep Jain , David Wyatt , Jun Shi , Animesh Mishra , John Halbert , Melik Isbara
- Applicant: Sandeep Jain , David Wyatt , Jun Shi , Animesh Mishra , John Halbert , Melik Isbara
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G11C7/04
- IPC: G11C7/04 ; G11C5/06

Abstract:
The temperature for multiple devices of a memory module are determined. In one example a memory module includes a printed circuit board, a plurality of memory chips on the printed circuit board, each chip containing a plurality of memory cells and a thermal sensor, and a multiplexer on the printed circuit board, independent of the memory chips, coupled to each of the thermal sensors. A current source is coupled to the multiplexer to provide a current to each one of the thermal sensors, and a voltage detector is coupled to the multiplexer to detect a voltage from each of the thermal sensors when a current is applied. A temperature circuit is coupled to the voltage detector to determine a temperature for each memory chip based on the detected voltage.
Public/Granted literature
- US20070211548A1 Temperature determination and communication for multiple devices of a memory module Public/Granted day:2007-09-13
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