发明授权
- 专利标题: Temperature determination and communication for multiple devices of a memory module
- 专利标题(中): 存储器模块的多个器件的温度测定和通信
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申请号: US11801909申请日: 2007-05-10
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公开(公告)号: US07450456B2公开(公告)日: 2008-11-11
- 发明人: Sandeep Jain , David Wyatt , Jun Shi , Animesh Mishra , John Halbert , Melik Isbara
- 申请人: Sandeep Jain , David Wyatt , Jun Shi , Animesh Mishra , John Halbert , Melik Isbara
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: G11C7/04
- IPC分类号: G11C7/04 ; G11C5/06
摘要:
The temperature for multiple devices of a memory module are determined. In one example a memory module includes a printed circuit board, a plurality of memory chips on the printed circuit board, each chip containing a plurality of memory cells and a thermal sensor, and a multiplexer on the printed circuit board, independent of the memory chips, coupled to each of the thermal sensors. A current source is coupled to the multiplexer to provide a current to each one of the thermal sensors, and a voltage detector is coupled to the multiplexer to detect a voltage from each of the thermal sensors when a current is applied. A temperature circuit is coupled to the voltage detector to determine a temperature for each memory chip based on the detected voltage.
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