发明授权
- 专利标题: Polishing apparatus
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申请号: US11878030申请日: 2007-07-20
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公开(公告)号: US07465221B2公开(公告)日: 2008-12-16
- 发明人: Masanobu Iwasaki , Yoshio Hayashide
- 申请人: Masanobu Iwasaki , Yoshio Hayashide
- 申请人地址: JP Tokyo
- 专利权人: Renesas Technology Corp.
- 当前专利权人: Renesas Technology Corp.
- 当前专利权人地址: JP Tokyo
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2000-363478 20001129
- 主分类号: B24B5/00
- IPC分类号: B24B5/00 ; B24B1/00 ; B24B57/00
摘要:
A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of abrasive slurry, the mist of additive and the mist of pure water to prepare polishing solution, and supplies the polishing solution onto the major surface of a polishing stage.
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