- 专利标题: Coating film forming method and apparatus
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申请号: US11091760申请日: 2005-03-29
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公开(公告)号: US07510611B2公开(公告)日: 2009-03-31
- 发明人: Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
- 申请人: Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
- 申请人地址: JP Tokyo-To
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo-To
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2001-117191 20010416; JP2001-127823 20010425
- 主分类号: B05B3/00
- IPC分类号: B05B3/00 ; B05C11/02 ; B05C11/00 ; B08B3/00
摘要:
A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.
公开/授权文献
- US20050170087A1 Coating film forming method and apparatus 公开/授权日:2005-08-04