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公开(公告)号：US20050170087A1
公开(公告)日：2005-08-04
申请号：US11091760
申请日：2005-03-29
CPC分类号： H01L21/6715 , B05D1/005 , B05D1/02
摘要： A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.
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公开(公告)号：US07488505B2
公开(公告)日：2009-02-10
申请号：US10885577
申请日：2004-07-08
IPC分类号： B05D3/12
CPC分类号： H01L21/67253 , B05D1/005 , B05D1/26 , H01L21/6715
摘要： When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part. If the uncoated region is continuously detected at the same place with respect to two substrates, it is determined that the setting of coating data is erroneous, and this is modified.
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公开(公告)号：US07510611B2
公开(公告)日：2009-03-31
申请号：US11091760
申请日：2005-03-29
CPC分类号： H01L21/6715 , B05D1/005 , B05D1/02
摘要： A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.
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公开(公告)号：US06884294B2
公开(公告)日：2005-04-26
申请号：US10122390
申请日：2002-04-16
CPC分类号： H01L21/6715 , B05D1/005 , B05D1/02
摘要： A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.
摘要翻译： 当喷嘴从晶片中心移动到晶片外部区域上时，将涂布溶液喷涂在从设置在晶片上方的喷嘴水平保持的旋转晶片上，从而将涂布溶液螺旋地喷涂在晶片上。 当涂层溶液已经到达晶片外部区域时，喷嘴停止，并且在晶片旋转的同时将涂布溶液圆形喷涂在晶片外部区域上。 包括涂膜和溶剂的组分的涂布溶液可以喷涂在晶片和涂布溶液的待涂覆的第一区域上，并且用于涂膜的溶剂可以喷涂在位于第一区域外部的第二边缘区域 的晶片。
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公开(公告)号：US06776845B2
公开(公告)日：2004-08-17
申请号：US10152562
申请日：2002-05-23
IPC分类号： B05C1100
CPC分类号： H01L21/67253 , B05D1/005 , B05D1/26 , H01L21/6715
摘要： When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part. If the uncoated region is continuously detected at the same place with respect to two substrates, it is determined that the setting of coating data is erroneous, and this is modified.
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