Coating film forming method and system

    公开(公告)号:US07488505B2

    公开(公告)日:2009-02-10

    申请号:US10885577

    申请日:2004-07-08

    IPC分类号: B05D3/12

    摘要: When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part. If the uncoated region is continuously detected at the same place with respect to two substrates, it is determined that the setting of coating data is erroneous, and this is modified.

    Coating film forming method and apparatus
    4.
    发明授权
    Coating film forming method and apparatus 失效
    涂膜形成方法和装置

    公开(公告)号:US06884294B2

    公开(公告)日:2005-04-26

    申请号:US10122390

    申请日:2002-04-16

    摘要: A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.

    摘要翻译: 当喷嘴从晶片中心移动到晶片外部区域上时,将涂布溶液喷涂在从设置在晶片上方的喷嘴水平保持的旋转晶片上,从而将涂布溶液螺旋地喷涂在晶片上。 当涂层溶液已经到达晶片外部区域时,喷嘴停止,并且在晶片旋转的同时将涂布溶液圆形喷涂在晶片外部区域上。 包括涂膜和溶剂的组分的涂布溶液可以喷涂在晶片和涂布溶液的待涂覆的第一区域上,并且用于涂膜的溶剂可以喷涂在位于第一区域外部的第二边缘区域 的晶片。

    Coating film forming method and system

    公开(公告)号:US06776845B2

    公开(公告)日:2004-08-17

    申请号:US10152562

    申请日:2002-05-23

    IPC分类号: B05C1100

    摘要: When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part. If the uncoated region is continuously detected at the same place with respect to two substrates, it is determined that the setting of coating data is erroneous, and this is modified.

    Low-pressure dryer and low-pressure drying method

    公开(公告)号:US06986214B2

    公开(公告)日:2006-01-17

    申请号:US10859088

    申请日:2004-06-03

    IPC分类号: F26B3/00

    摘要: A low-pressure dryer dries a substrate applied a coating solution thereon at low pressure. The dryer includes an airtight chamber installing a substrate table to place the substrate thereon; a diffuser plate, provided as facing the substrate placed on the substrate table with a gap, for discharging gas existing in the gap toward outside, the diffuser plate having a size almost the same as or larger than the substrate; a substrate-temperature adjuster, installed in the substrate table, for adjusting a temperature of the substrate; and a decompression mechanism for decompressing the airtight chamber. The diffuser plate has a temperature adjuster for making temperature adjustments to have a temperature difference between a first region and a second region of the diffuser plate, the first region facing a center region of the substrate, the second region being outside the first region and including a region facing an outer region of the substrate.

    Film forming method and film forming apparatus
    7.
    发明授权
    Film forming method and film forming apparatus 有权
    成膜方法和成膜装置

    公开(公告)号:US06371667B1

    公开(公告)日:2002-04-16

    申请号:US09545003

    申请日:2000-04-06

    IPC分类号: G03D500

    CPC分类号: G03D5/00

    摘要: A resist solution discharge nozzle for discharging a resist solution to a wafer is moved at a constant speed along a radial direction of the wafer while the wafer is being rotated. During this movement, the amount of the resist solution to be discharged from the resist solution discharge nozzle is gradually decreased. The resist solution discharged to the wafer is applied to the front surface of the wafer drawing a spiral track, and coating amounts of the resist solution per unit area with respect to a central portion and a peripheral portion of the wafer can be made equal. Accordingly, waste of a processing solution supplied onto a substrate can be eliminated, and a uniform processing solution film can be formed on the substrate.

    摘要翻译: 用于将抗蚀剂溶液放电到晶片的抗蚀剂溶液排出喷嘴在晶片旋转的同时沿着晶片的径向以恒定的速度移动。 在该运动中,从抗蚀剂溶液排出喷嘴排出的抗蚀剂溶液的量逐渐降低。 将排出到晶片的抗蚀剂溶液施加到晶片的前表面,从而绘制螺旋轨道,并且可以使相对于晶片的中心部分和周边部分的每单位面积的抗蚀剂溶液的涂布量相等。 因此,能够消除供给到基板上的处理液的浪费,能够在基板上形成均匀的处理液膜。

    Low-pressure dryer and low-pressure drying method
    8.
    发明授权
    Low-pressure dryer and low-pressure drying method 失效
    低压干燥机和低压干燥方法

    公开(公告)号:US06796054B2

    公开(公告)日:2004-09-28

    申请号:US10384571

    申请日:2003-03-11

    IPC分类号: F26B300

    摘要: A low-pressure dryer dries a substrate applied a coating solution thereon at low pressure. The dryer includes an airtight chamber installing a substrate table to place the substrate thereon; a diffuser plate, provided as facing the substrate placed on the substrate table with a gap, for discharging gas existing in the gap toward outside, the diffuser plate having a size almost the same as or larger than the substrate; a substrate-temperature adjuster, installed in the substrate table, for adjusting a temperature of the substrate; and a decompression mechanism for decompressing the airtight chamber. The diffuser plate has a temperature adjuster for making temperature adjustments to have a temperature difference between a first region and a second region of the diffuser plate, the first region facing a center region of the substrate, the second region being outside the first region and including a region facing an outer region of the substrate.

    摘要翻译: 低压干燥器在低压下干燥在其上涂布涂布溶液的基材。 干燥机包括安装基板台的气密室,以将基板放置在其上; 扩散板,其设置为具有间隙放置在基板台上的基板,用于将存在于间隙中的气体朝向外部排出,扩散板具有与基板大致相同或更大的尺寸; 衬底温度调节器,安装在衬底台中,用于调节衬底的温度; 以及用于对气密室进行减压的减压机构。 扩散板具有温度调节器,用于使温度调节在扩散板的第一区域和第二区域之间具有温度差,第一区域面向基板的中心区域,第二区域在第一区域的外部,并且包括 面向衬底的外部区域的区域。

    Temperature measuring device, thermal processor having temperature measurement function and temperature measurement method
    9.
    发明申请
    Temperature measuring device, thermal processor having temperature measurement function and temperature measurement method 有权
    温度测量装置,具有温度测量功能和温度测量方法的热处理器

    公开(公告)号:US20070170170A1

    公开(公告)日:2007-07-26

    申请号:US11642827

    申请日:2006-12-21

    IPC分类号: H05B1/02

    CPC分类号: H05B1/0233 H01L21/67248

    摘要: This invention provides a wafer-type temperature sensor capable of eliminating the need for an A/D converter, adapting itself to automation and improving the heat resistance to measure temperature distribution of the upper surface of a wafer, a temperature measuring device using the sensor, a thermal processor having a temperature measurement function and a temperature measurement method. The wafer-type temperature sensor comprises a wafer and a plurality of temperature sensors arranged in regions which are formed by segmenting the upper surface of the wafer into a plurality of regions. Each of the temperature sensors includes an oscillation circuit for oscillating a frequency signal corresponding to the temperature of its own region within a frequency band that is different for every region in response to input of power supply voltage.

    摘要翻译: 本发明提供一种晶片式温度传感器,其能够消除对A / D转换器的需要,适应自动化和提高耐热性,以测量晶片上表面的温度分布,使用该传感器的温度测量装置, 具有温度测量功能和温度测量方法的热处理器。 晶片型温度传感器包括晶片和多个温度传感器,其布置在通过将晶片的上表面分割成多个区域而形成的区域中。 每个温度传感器包括振荡电路,用于响应于电源电压的输入,在与每个区域不同的频带内振荡对应于其自身区域的温度的频率信号。

    Low-pressure dryer and low-pressure drying method

    公开(公告)号:US07024798B2

    公开(公告)日:2006-04-11

    申请号:US11087690

    申请日:2005-03-24

    IPC分类号: F26B3/00

    摘要: A low-pressure dryer dries a substrate applied a coating solution thereon at low pressure. The dryer includes an airtight chamber installing a substrate table to place the substrate thereon; a diffuser plate, provided as facing the substrate placed on the substrate table with a gap, for discharging gas existing in the gap toward outside, the diffuser plate having a size almost the same as or larger than the substrate; a substrate-temperature adjuster, installed in the substrate table, for adjusting a temperature of the substrate; and a decompression mechanism for decompressing the airtight chamber. The diffuser plate has a temperature adjuster for making temperature adjustments to have a temperature difference between a first region and a second region of the diffuser plate, the first region facing a center region of the substrate, the second region being outside the first region and including a region facing an outer region of the substrate.