发明授权
- 专利标题： Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
- 专利标题（中）： 半导体装置及其制造方法，电路基板，电子设备及半导体装置的制造装置
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申请号： US11267328申请日： 2005-11-07
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公开(公告)号： US07594644B2公开(公告)日： 2009-09-29
- 发明人: Takao Yamazaki , Hirobumi Inoue , Ichiro Hazeyama , Sakae Kitajo , Masahiro Kubo , Yoshimichi Sogawa , Hidehiko Kuroda
- 申请人： Takao Yamazaki , Hirobumi Inoue , Ichiro Hazeyama , Sakae Kitajo , Masahiro Kubo , Yoshimichi Sogawa , Hidehiko Kuroda
- 申请人地址： JP Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2002/255530 20020830; JP2002/331411 20021114
- 主分类号： B25B11/00
- IPC分类号： B25B11/00
摘要：
A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
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