公开(公告)号：US06998704B2

公开(公告)日：2006-02-14

申请号：US10644952

申请日：2003-08-21

申请人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

发明人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L25/105 ,  H01L2224/02371 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

公开(公告)号：US07594644B2

公开(公告)日：2009-09-29

申请号：US11267328

申请日：2005-11-07

申请人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

发明人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

IPC分类号： B25B11/00

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L25/105 ,  H01L2224/02371 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

摘要翻译： 提供一种半导体器件，包括具有电路和电路的至少一个电极的半导体元件，具有至少一个电极焊盘并围绕半导体元件的柔性基板，用于将电极与电极焊盘连接的导体，以及多个 在电极焊盘上的焊料凸点，其中面对半导体元件的焊料凸块的表面和柔性基板之间的至少第一部分不通过粘附固定。

公开(公告)号：US20060055053A1

公开(公告)日：2006-03-16

申请号：US11267328

申请日：2005-11-07

申请人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

发明人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L25/105 ,  H01L2224/02371 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

公开(公告)号：US07230328B2

公开(公告)日：2007-06-12

申请号：US10528160

申请日：2003-11-19

申请人： Ichiro Hazeyama ,  Yoshimichi Sogawa ,  Takao Yamazaki ,  Sakae Kitajo

发明人： Ichiro Hazeyama ,  Yoshimichi Sogawa ,  Takao Yamazaki ,  Sakae Kitajo

IPC分类号： H01L23/02

CPC分类号： H01L23/3114 ,  H01L23/5387 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00

摘要： A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.

摘要翻译： 半导体封装具有半导体器件芯片和具有热塑性绝缘树脂层的柔性基板。 设置在柔性基板上的电极连接到半导体器件芯片的预定电极并被热塑性绝缘树脂层密封。 柔性基板弯曲并在电极轴承和其它表面上设置电极。 柔性基板具有多层布线。 在柔性基板或弯曲部的区域的弯曲处形成具有不同数量的布线层的沟槽或薄层部分，从而在半导体器件被封装的部分形成空腔。 然后，柔性基板在预定位置弯曲以形成不依赖于半导体器件芯片的外部尺寸的半导体封装。

公开(公告)号：US20060049495A1

公开(公告)日：2006-03-09

申请号：US10528160

申请日：2003-11-19

申请人： Ichiro Hazeyama ,  Yoshimichi Sogawa ,  Takao Yamazaki ,  Sakae Kitajo

发明人： Ichiro Hazeyama ,  Yoshimichi Sogawa ,  Takao Yamazaki ,  Sakae Kitajo

IPC分类号： H01L23/02

CPC分类号： H01L23/3114 ,  H01L23/5387 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00

摘要： A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.

摘要翻译： 半导体封装具有半导体器件芯片和具有热塑性绝缘树脂层的柔性基板。 设置在柔性基板上的电极连接到半导体器件芯片的预定电极并被热塑性绝缘树脂层密封。 柔性基板弯曲并在电极轴承和其它表面上设置电极。 柔性基板具有多层布线。 在柔性基板或弯曲部的区域的弯曲处形成具有不同数量的布线层的沟槽或薄层部分，从而在半导体器件被封装的部分形成空腔。 然后，柔性基板在预定位置弯曲以形成不依赖于半导体器件芯片的外部尺寸的半导体封装。

公开(公告)号：US20060103028A1

公开(公告)日：2006-05-18

申请号：US10540863

申请日：2003-12-24

申请人： Ichiro Hazeyama ,  Masahiro Kubo ,  Sakae Kitajo ,  Koji Matsui ,  Kazumasa Igarashi ,  Hiroshi Noro

发明人： Ichiro Hazeyama ,  Masahiro Kubo ,  Sakae Kitajo ,  Koji Matsui ,  Kazumasa Igarashi ,  Hiroshi Noro

IPC分类号： H01L21/48 ,  H01L23/48

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19042 ,  H01L2924/351 ,  Y02P20/582 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C) (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N′,N′-tetra-substituted fluorine-containing aromatic diamine compound. (D) A carboxylic acid vinyl ether addition product.

摘要翻译： 本发明的目的是提供一种电子零件装置，即使在进行底部填充之后，在具有电连接故障的电子部件装置的情况下也能够进行维修。 本发明是一种电子部件装置，其中半导体元件（倒装芯片）（3）安装在布线电路基板（1）上，该状态使得设置在半导体元件上的连接用电极部（接合球） 倒装芯片）（3）和设置在布线电路基板（1）上的电路电极（5）彼此面对。 此外，布线电路基板（1）与半导体元件（倒装芯片）（3）之间的间隙由包含液体环氧树脂组合物的填充树脂层（4）填充，该液体环氧树脂组合物包含以下组分（D）和 以下成分（A）〜（C）（A）为液态环氧树脂。 （B）固化剂。 （C）N，N，N'，N'-四取代的含氟芳族二胺化合物。 （D）羧酸乙烯基醚加成物。

公开(公告)号：US06674016B2

公开(公告)日：2004-01-06

申请号：US10246666

申请日：2002-09-19

申请人： Masahiro Kubo ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Koji Matsui ,  Kazumasa Igarashi

发明人： Masahiro Kubo ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Koji Matsui ,  Kazumasa Igarashi

IPC分类号： H05K116

CPC分类号： H01L23/293 ,  C08G59/5033 ,  C08G59/504 ,  C08K5/18 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01087 ,  H01L2924/10253 ,  C08L63/00 ,  H01L2924/00

摘要： An electronic component is described, which contains a printed circuit board having electrodes for connection and a semiconductor chip having electrodes for connection which is mounted on said circuit board with their electrodes facing those of the circuit board, the gap between the circuit board and the semiconductor chip being filled with a sealing resin layer, wherein the sealing resin layer is formed of a liquid epoxy resin composition containing (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an N,N,N′,N′-tetrasubstituted fluorine-containing aromatic diamine derivative.

摘要翻译： 描述了一种电子部件，其包含具有用于连接的电极的印刷电路板和具有连接用电极的半导体芯片，该半导体芯片安装在所述电路板上，其电极与电路板的电极相对，电路板与半导体之间的间隙 其中所述密封树脂层由液态环氧树脂组合物形成，所述液体环氧树脂组合物含有（A）液体环氧树脂，（B）固化剂，（C）无机填料和（D） N，N，N'，N'-四取代的含氟芳族二胺衍生物。

公开(公告)号：US07352069B2

公开(公告)日：2008-04-01

申请号：US10540863

申请日：2003-12-24

申请人： Ichiro Hazeyama ,  Masahiro Kubo ,  Sakae Kitajo ,  Koji Matsui ,  Kazumasa Igarashi ,  Hiroshi Noro

发明人： Ichiro Hazeyama ,  Masahiro Kubo ,  Sakae Kitajo ,  Koji Matsui ,  Kazumasa Igarashi ,  Hiroshi Noro

IPC分类号： H01L23/29

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19042 ,  H01L2924/351 ,  Y02P20/582 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill.The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C). (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N′,N′-tetra-substituted fluorine-containing aromatic diamine compound. (D) A carboxylic acid vinyl ether addition product.

摘要翻译： 本发明的目的是提供一种电子零件装置，即使在进行底部填充之后，在具有电连接故障的电子部件装置的情况下也能够进行维修。 本发明是一种电子部件装置，其中半导体元件（倒装芯片）（3）安装在布线电路基板（1）上，该状态使得设置在半导体元件上的连接用电极部（接合球） 倒装芯片）（3）和设置在布线电路基板（1）上的电路电极（5）彼此面对。 此外，布线电路基板（1）与半导体元件（倒装芯片）（3）之间的间隙由包含液体环氧树脂组合物的填充树脂层（4）填充，该液体环氧树脂组合物包含以下组分（D）和 以下组分（A）至（C）。 （A）液体环氧树脂。 （B）固化剂。 （C）N，N，N'，N'-四取代的含氟芳族二胺化合物。 （D）羧酸乙烯基醚加成物。

公开(公告)号：US07119438B2

公开(公告)日：2006-10-10

申请号：US10501195

申请日：2003-01-10

申请人： Ichiro Hazeyama ,  Masahiro Kubo ,  Sakae Kitajo ,  Kazuhiko Futakami ,  Shinichi Ishiduka ,  Susumu Nanko ,  Hitoshi Anma ,  Tosiji Yamada ,  Akeo Katahira

发明人： Ichiro Hazeyama ,  Masahiro Kubo ,  Sakae Kitajo ,  Kazuhiko Futakami ,  Shinichi Ishiduka ,  Susumu Nanko ,  Hitoshi Anma ,  Tosiji Yamada ,  Akeo Katahira

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/742 ,  B23K3/0607 ,  B23K3/0623 ,  B23K2101/42 ,  H01L24/11 ,  H01L2224/02123 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/3478 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of arranging microspheres with liquid, a microsphere arranging device, and a semiconductor device are provided. The method comprising the steps of placing the semiconductor device with a large number of pads with holes, on a loading table with a variable tilt angle, and pouring microspheres together with conductive liquid held in a holding container onto the semiconductor device. The microspheres are storably placed in the holes on the pads of the semiconductor device. The non-stored microspheres and conductive liquid are accumulated in a receiving tank, and the conductive liquid including the accumulated microspheres are transferred to the holding container by a pump.

摘要翻译： 提供了一种使用液体布置微球的方法，微球排列装置和半导体装置。 该方法包括以下步骤：将具有孔的大量垫片的半导体器件放置在具有可变倾斜角的装载台上，以及将保持在保持容器中的导电液体一起倾倒到半导体器件上。 微球体可储存地放置在半导体器件的焊盘上的孔中。 未储存的微球体和导电液体积聚在接收罐中，并且包含积聚的微球的导电液体通过泵转移到保持容器。

公开(公告)号：US20050040528A1

公开(公告)日：2005-02-24

申请号：US10501195

申请日：2003-01-10

申请人： Ichiro Hazeyama ,  Masahiro Kubo ,  Sakae Kitajo ,  Kazuhiko Futakami ,  Shinichi Ishiduka ,  Susumu Nanko ,  Hitoshi Anma ,  Tosiji Yamada ,  Akeo Katahira

发明人： Ichiro Hazeyama ,  Masahiro Kubo ,  Sakae Kitajo ,  Kazuhiko Futakami ,  Shinichi Ishiduka ,  Susumu Nanko ,  Hitoshi Anma ,  Tosiji Yamada ,  Akeo Katahira

IPC分类号： B23K3/06 ,  H01L21/60 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/742 ,  B23K3/0607 ,  B23K3/0623 ,  B23K2101/42 ,  H01L24/11 ,  H01L2224/02123 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/3478 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of arranging micro spheres with liquid, a micro sphere arranging device and a semiconductor device, the method comprising the steps of placing the semiconductor device (2) with holes placed, through a large number of pads, on a loading table (3) with variable tilt angle, flowing macro spheres together with conductive liquid held in a holding container (6) down to the semiconductor device (2) to storably place the micro spheres on the pad storably in the holes of the semiconductor device (2), receiving and accumulating the non-stored micro spheres and conductive liquid by a receiving tank (1), and carrying the conductive liquid including the accumulated micro spheres to the holding container (6) by a pump (11)

摘要翻译： 一种用液体排列微球的方法，微球排列装置和半导体装置，所述方法包括以下步骤：将半导体器件（2）放置在穿过大量衬垫的孔放置在装载台（3）上， 具有可变的倾斜角度，流动的宏观球体与保持在保持容器（6）中的导电液体一起向下到达半导体器件（2），以将微球保存在衬垫上，可储存在半导体器件（2）的孔中，接收 并通过接收罐（1）积存未储存的微球和导电液体，并通过泵（11）将包含累积的微球的导电液体携带到保持容器（6）