公开(公告)号：US09283812B2

公开(公告)日：2016-03-15

申请号：US13511937

申请日：2010-11-25

申请人： Hirobumi Inoue

发明人： Hirobumi Inoue

IPC分类号： B60C13/00 ,  B60C3/00 ,  B60C15/06 ,  B60C11/01 ,  B60C3/04 ,  B60C9/14

CPC分类号： B60C11/01 ,  B60C3/04 ,  B60C9/14 ,  B60C13/003 ,  B60C15/0607 ,  B60C2200/06

摘要： A pneumatic radial tire for heavy loads that prevents occurrence of a side cut due to a projection while decelerating spread of a cut damage to a tire inner surface. In a widthwise cross section of the tire, angle α satisfies a relation 0

摘要翻译： 一种用于重负载的充气子午线轮胎，其防止在对轮胎内表面的切割损伤的扩展减速的同时由于投影而发生侧切。 在轮胎的宽度方向横截面中，角度α满足关于径向线段形成连接虚拟线与轮胎外表面之间的相交线和最大轮胎宽度位置的线的关系0 <α＆nlE; 30°， 虚拟线穿过平行于轮胎轴线的最大胎体宽度位置。 角＆bgr 满足关于径向线段形成接合最大轮胎宽度位置和切断点的线的关系0＆lt; nlE;＆bgr <30°，并且增强橡胶设置在主体部分和折叠部分 胴体

公开(公告)号：US07434190B2

公开(公告)日：2008-10-07

申请号：US11473345

申请日：2006-06-23

申请人： Hirobumi Inoue ,  Daisuke Ohshima ,  Jun Sakai ,  Mitsuru Furuya

发明人： Hirobumi Inoue ,  Daisuke Ohshima ,  Jun Sakai ,  Mitsuru Furuya

IPC分类号： G06F17/50

CPC分类号： G06F17/5036 ,  G06F2217/40

摘要： An analysis method of designing transmission lines of an integrated circuit packaging board including an integrated circuit chip, a printed circuit board, and an interposer disposed between the integrated circuit chip and the printed circuit board. A reference data file having information for dividing a series of transmission lines into connecting sections and/or continuous sections and a division model file having information on analysis models of a connecting section and a continuous section is prepared. The connecting sections are extracted from the series of transmission lines with reference to connection information. Boundaries for dividing the series of transmission lines into sections is determined with reference to the reference data file to generate division models. The division models are synthesized to form a synthesized model of the series of transmission lines to analyze electrical characteristics of the series of transmission lines.

摘要翻译： 包括设置在集成电路芯片和印刷电路板之间的集成电路芯片，印刷电路板和插入器的集成电路封装板的传输线的分析方法。 准备具有用于将一系列传输线分成连接部分和/或连续部分的信息的参考数据文件和具有关于连接部分和连续部分的分析模型的信息的分割模型文件。 参考连接信息，从一系列传输线中提取连接部分。 参考参考数据文件确定将一系列传输线划分为多个部分的边界，以生成分割模型。 合成分割模型以形成一系列传输线的合成模型，以分析一系列传输线的电气特性。

公开(公告)号：US06229321B1

公开(公告)日：2001-05-08

申请号：US09238268

申请日：1999-01-27

申请人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Masahiko Nikaidou ,  Toru Taura ,  Yuuichi Yamagishi ,  Satoshi Hayakawa

发明人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Masahiko Nikaidou ,  Toru Taura ,  Yuuichi Yamagishi ,  Satoshi Hayakawa

IPC分类号： G01R3102

CPC分类号： H01L22/20 ,  G01R1/06772 ,  G01R31/2851 ,  G01R31/318513 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01019 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A process for manufacturing a high frequency multichip module includes a reception inspection step which includes steps of preparing a vertical-type probe, setting the high frequency bare chip on a device stage, and measuring high frequency characteristics of the high frequency bare chip using the vertical-type probe. The prepared vertical-type probe has a center conductor and ground conductors arranged at both sides of the tip portion of the center conductor in the vertical direction in which the probe is pressed to electrodes of the high frequency bare chip. The high frequency bare chip has a ground electrode disposed at the opposite side of the chip from the signal electrodes on the upper surface of a device stage. Then, only a good product is fed to the next step. After the reception inspection, the process goes to a component mounting step. Preferably, the process goes to the next step when the high frequency multichip modules passes at least on of a performance test and visual inspection after the component mounting step.

摘要翻译： 一种制造高频多芯片模块的方法，包括接收检查步骤，包括准备垂直型探针，在器件载物台上设置高频裸芯片，以及使用垂直方向测量高频裸芯片的高频特性 型探针。 所制备的垂直型探针具有中心导体和布置在中心导体的尖端部分的两侧的接地导体，该垂直方向上的探针被压到高频裸芯片的电极上。 高频裸芯片具有设置在与器件级的上表面上的信号电极的芯片相对侧的接地电极。 然后，只有一个好的产品被送入下一步。 在接收检查之后，处理进行到组件安装步骤。 优选地，当高频多芯片模块在部件安装步骤之后至少进行性能测试和目视检查时，该过程进行到下一步骤。

公开(公告)号：US06400168B2

公开(公告)日：2002-06-04

申请号：US09886033

申请日：2001-06-22

申请人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Toru Taura ,  Masahiko Nikaidou ,  Yuuichi Yamagishi ,  Satoshi Hayakawa

发明人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Toru Taura ,  Masahiko Nikaidou ,  Yuuichi Yamagishi ,  Satoshi Hayakawa

IPC分类号： G01R3102

CPC分类号： G01R1/06738 ,  G01R1/06772 ,  Y10T29/49123

摘要： In a tip portion structure basically having a substrate, a plate spring, and a ground block, the substrate is attached to a signal line on a back surface of the substrate and is contacted on the tip with the signal electrode of the DUT placed on a device stage. The plate spring is made of a resilient material, placed on the front side of the substrate, and positioned to apply a pressure to the substrate. The ground block is positioned between the signal line and the device stage functioned as a ground electrode of the DUT. Alternatively, the tip portion structure further may have a ground plate or a ground surface formed of a conductive thin plate covering entirely the front surface of the substrate, and shaped to surround the signal line in cooperation with the ground block. A plurality of the signal lines may be arranged in parallel on the same plane of the substrate. Another tip portion structure is based on a coaxial cable to be cut from the center at a plane perpendicular to the axial direction thereof along one or more oblique plane. A metal ring fitted over a periphery of the coaxial outer conductor may be used.

摘要翻译： 在基本上具有基板，板簧和接地块的尖端部分结构中，将基板附着到基板的背面上的信号线上，并将其与被放置在基板上的DUT的信号电极接触 设备阶段 板簧由弹性材料制成，放置在基片的正面，并定位成对基片施加压力。 接地块位于作为DUT接地电极的信号线和器件级之间。 或者，尖端部分结构还可以具有由完全覆盖基板的前表面的导电薄板形成的接地板或接地表面，并且成形为与接地块一起包围信号线。 多个信号线可以平行布置在基板的同一平面上。 另一个尖端部分结构是基于同轴电缆，沿着一个或多个倾斜平面在垂直于其轴向方向的平面处从中心切割。 可以使用安装在同轴外导体周边上的金属环。

公开(公告)号：US20120247638A1

公开(公告)日：2012-10-04

申请号：US13511937

申请日：2010-11-25

申请人： Hirobumi Inoue

发明人： Hirobumi Inoue

IPC分类号： B60C9/02 ,  B60C15/00

CPC分类号： B60C11/01 ,  B60C3/04 ,  B60C9/14 ,  B60C13/003 ,  B60C15/0607 ,  B60C2200/06

摘要： A pneumatic radial tire for heavy loads that prevents occurrence of a side cut due to a projection while decelerating spread of a cut damage to a tire inner surface. In a widthwise cross section of the tire, angle α satisfies a relation 0

摘要翻译： 一种用于重负载的充气子午线轮胎，其防止在对轮胎内表面的切割损伤的扩展减速的同时由于投影而发生侧切。 在轮胎的宽度方向横截面中，角度α满足关于径向线段形成连接虚拟线与轮胎外表面之间的相交线和最大轮胎宽度位置的线的关系0 <α＆nlE; 30°， 虚拟线穿过平行于轮胎轴线的最大胎体宽度位置。 角＆bgr 满足相对于径向线段形成接合最大轮胎宽度位置和切断点的线的关系0＆lt; nlE;＆bgr; <30°，并且增强橡胶设置在主体部分和翻转部分之间 胴体

公开(公告)号：US20060103004A1

公开(公告)日：2006-05-18

申请号：US11274182

申请日：2005-11-16

申请人： Jun Sakai ,  Hirobumi Inoue ,  Kazuhiro Motonaga

发明人： Jun Sakai ,  Hirobumi Inoue ,  Kazuhiro Motonaga

IPC分类号： H01L23/12

CPC分类号： H05K1/0218 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/112 ,  H05K2201/0715 ,  H01L2224/0401

摘要： It is to provide a wiring board for a semiconductor integrated circuit package, which exhibits an excellent signal property and a high effect for decreasing the switching noise at the time of mounting an LSI of an area-array structure. In a multilayer wiring board for a package, which comprises, on a wiring layer of an LSI chip mount surface, a ground pad, a power supply pad, and a signal pad for mounting LSI chip, and a ground plane that extends around a group of those pads, the ground pad disposed on the inner side, among the above-described pads, is connected to the ground plane that surrounds the pad group through a connecting wiring.

摘要翻译： 提供一种用于半导体集成电路封装的布线板，其具有优异的信号特性和用于降低安装区域阵列结构的LSI时的开关噪声的高效果。 在一种用于封装的多层布线板中，其包括在LSI芯片安装表面的布线层上的接地焊盘，电源焊盘和用于安装LSI芯片的信号焊盘以及围绕一组延伸的接地平面 在这些焊盘中，设置在上述焊盘中的内侧的接地焊盘通过连接布线连接到围绕焊盘组的接地平面。

公开(公告)号：US06998704B2

公开(公告)日：2006-02-14

申请号：US10644952

申请日：2003-08-21

申请人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

发明人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L25/105 ,  H01L2224/02371 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

公开(公告)号：US06242930B1

公开(公告)日：2001-06-05

申请号：US09196953

申请日：1998-11-20

申请人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Toru Taura ,  Masahiko Nikaidou ,  Yuuichi Yamagishi ,  Satoshi Hayakawa ,  Hironori Tsugane

发明人： Kouji Matsunaga ,  Hirobumi Inoue ,  Masao Tanehashi ,  Toru Taura ,  Masahiko Nikaidou ,  Yuuichi Yamagishi ,  Satoshi Hayakawa ,  Hironori Tsugane

IPC分类号： G01R3102

CPC分类号： G01R1/06772

摘要： In a high-frequency probe having a detachable end according to the present invention, parts relating to replacement of an end unit are three parts, that is, an end unit, a probe body, and a pressure block. The end unit comprises a coaxial cable, two slender plate-like ground plates. The coaxial cable is linear in the direction of the end of the high-frequency probe. The ground plates sandwich the coaxial cable. The probe body has an end unit support surface, a circuit board, an end unit arrangement surface and an end part guide. The end unit support surface forms a perpendicular surface used for fixing the end unit to a predetermined position in the end side of the central block in a central part of a surface of the body block. The circuit board connects the end unit to a coaxial connector. The end unit arrangement surface forms a plane in an end side of the body block. And further the guide groove positions and fixes the ground plate in the end part. It is capable to supply positioning pins and a positioning pin holes in mutual contact surfaces for positioning. The present invention makes it possible to adjust characteristic impedance of the probe end part by providing an elastically-shaped part for securing contact pressure and using a pipe or the ground plate in an exposed part of the coaxial inner conductor for performing gap adjustment.

摘要翻译： 在根据本发明的具有可拆卸端部的高频探头中，与端部单元的更换相关的部件是端部单元，探针主体和压力块三部分。 端部单元包括同轴电缆，两个细长的板状接地板。 同轴电缆在高频探头端部的方向是线性的。 接地板夹着同轴电缆。 探头主体具有端部单元支撑表面，电路板，端部单元布置表面和端部引导件。 端部单元支撑表面形成垂直表面，用于将端部单元固定在主体块的表面的中心部分中的中心块的端侧中的预定位置。 电路板将端部单元连接到同轴连接器。 端部单元布置表面在主体块的端侧形成平面。 此外，引导槽定位并将接地板固定在端部。 能够在相互接触的表面上提供定位销和定位销孔，用于定位。 本发明通过提供一种用于确保接触压力的弹性形状部分并且在同轴内部导体的暴露部分中使用管道或接地板来进行间隙调节，可以调节探针端部的特性阻抗。

公开(公告)号：US20100032198A1

公开(公告)日：2010-02-11

申请号：US12528401

申请日：2008-02-20

申请人： Hirobumi Inoue

发明人： Hirobumi Inoue

IPC分类号： H05K1/02

CPC分类号： H05K1/025 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/183 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/091 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/10446 ,  H05K2201/10484

摘要： An inclined peripheral portion 103 having a tapered shape in a cross-sectional view, in which the thickness thereof is reduced toward the edge of an interconnection substrate 102, is provided at the edge of the interconnection substrate 102. In addition, inner layers 112 are provided such that the distance therebetween is reduced toward the edge of the interconnection substrate in the inclined peripheral portion 103. A first interconnection conductor 104 and a second interconnection conductor 105 are provided on both inclined planes of the inclined peripheral portion 103 so as to be electrically connected to each other at the leading end of the inclined peripheral portion 103.

摘要翻译： 在互连基板102的边缘处设置有在横截面视图中具有锥形形状的倾斜周边部分103，其中其厚度朝向互连基板102的边缘减小。另外，内层112 被设置为使得它们之间的距离朝向倾斜周边部分103中的互连基板的边缘减小。第一互连导体104和第二互连导体105设置在倾斜周边部分103的两个倾斜平面上，以便电 在倾斜周边部103的前端彼此连接。

公开(公告)号：US07594644B2

公开(公告)日：2009-09-29

申请号：US11267328

申请日：2005-11-07

申请人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

发明人： Takao Yamazaki ,  Hirobumi Inoue ,  Ichiro Hazeyama ,  Sakae Kitajo ,  Masahiro Kubo ,  Yoshimichi Sogawa ,  Hidehiko Kuroda

IPC分类号： B25B11/00

CPC分类号： H01L25/50 ,  H01L23/4985 ,  H01L25/105 ,  H01L2224/02371 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

摘要翻译： 提供一种半导体器件，包括具有电路和电路的至少一个电极的半导体元件，具有至少一个电极焊盘并围绕半导体元件的柔性基板，用于将电极与电极焊盘连接的导体，以及多个 在电极焊盘上的焊料凸点，其中面对半导体元件的焊料凸块的表面和柔性基板之间的至少第一部分不通过粘附固定。