An image pickup device includes a sensor substrate having image sensors arranged in its image pickup region in the form of a matrix. An interlayer insulating film layer is formed below a bottom of the sensor substrate. The interlayer insulating film layer includes wiring layers to construct an electric circuit. The wiring layer is electrically connected with the image sensors. A support substrate is attached on a bottom of the interlayer insulating film layer. The support substrate has contact electrodes formed in via holes. A lens layer is formed over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer. A light-transmitting member is formed over the lens layer.