发明授权
- 专利标题： Method for measuring a property of interconnections and structure for the same
- 专利标题（中）： 用于测量相互连接和结构的性质的方法
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申请号： US11849836申请日： 2007-09-04
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公开(公告)号： US07646207B2公开(公告)日： 2010-01-12
- 发明人: Jian-Hong Lin , Chin Chuan Peng , Shou-Chung Lee , Chien-Jung Wang , Chien Shih Tsai , Bi-Ling Lin , Yi-Lung Cheng
- 申请人： Jian-Hong Lin , Chin Chuan Peng , Shou-Chung Lee , Chien-Jung Wang , Chien Shih Tsai , Bi-Ling Lin , Yi-Lung Cheng
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Thomas, Kayden, Horstemeyer & Risley
- 主分类号： G01R27/08
- IPC分类号： G01R27/08
摘要：
A method for measuring a property of interconnections is provided. The method includes the following steps. A plurality of interconnection test patterns are provided. A pad to which the plurality of interconnection test patterns are parallelly connected is formed. At least one resistor is formed between at least one of the plurality of interconnection test patterns and the pad. The property of the plurality of interconnection test patterns is measured by applying a current, a voltage and/or a mechanical stress to the pad.