Invention Grant
US07691750B2 Methods of forming films in semiconductor devices with solid state reactants
有权
在具有固态反应物的半导体器件中形成膜的方法
- Patent Title: Methods of forming films in semiconductor devices with solid state reactants
- Patent Title (中): 在具有固态反应物的半导体器件中形成膜的方法
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Application No.: US11595441Application Date: 2006-11-09
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Publication No.: US07691750B2Publication Date: 2010-04-06
- Inventor: Ernest H. A. Granneman , Vladimir Kuznetsov , Xavier Pages , Cornelius A. van der Jeugd
- Applicant: Ernest H. A. Granneman , Vladimir Kuznetsov , Xavier Pages , Cornelius A. van der Jeugd
- Applicant Address: NL
- Assignee: ASM International N.V.
- Current Assignee: ASM International N.V.
- Current Assignee Address: NL
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
A method of self-aligned silicidation involves interruption of the silicidation process prior to complete reaction of the blanket material (e.g., metal) in regions directly overlying patterned and exposed other material (e.g., silicon). Diffusion of excess blanket material from over other regions (e.g., overlying insulators) is thus prevented. Control and uniformity are insured by use of conductive rapid thermal annealing in hot wall reactors, with massive heated plates closely spaced from the substrate surfaces. Interruption is particularly facilitated by forced cooling, preferably also by conductive thermal exchange with closely spaced, massive plates.
Public/Granted literature
- US20070059932A1 Methods of forming films in semiconductor devices with solid state reactants Public/Granted day:2007-03-15
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