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US07754552B2 Preventing silicide formation at the gate electrode in a replacement metal gate technology 失效
在替代金属栅极技术中防止栅电极处的硅化物形成

Preventing silicide formation at the gate electrode in a replacement metal gate technology
Abstract:
A hard mask may be formed and maintained over a polysilicon gate structure in a metal gate replacement technology. The maintenance of the hard mask, such as a nitride hard mask, may protect the polysilicon gate structure 14 from the formation of silicide or etch byproducts. Either the silicide or the etch byproducts or their combination may block the ensuing polysilicon etch which is needed to remove the polysilicon gate structure and to thereafter replace it with an appropriate metal gate technology.
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