Invention Grant
US07754552B2 Preventing silicide formation at the gate electrode in a replacement metal gate technology
失效
在替代金属栅极技术中防止栅电极处的硅化物形成
- Patent Title: Preventing silicide formation at the gate electrode in a replacement metal gate technology
- Patent Title (中): 在替代金属栅极技术中防止栅电极处的硅化物形成
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Application No.: US10629127Application Date: 2003-07-29
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Publication No.: US07754552B2Publication Date: 2010-07-13
- Inventor: Chris E. Barns , Justin K. Brask , Mark Doczy
- Applicant: Chris E. Barns , Justin K. Brask , Mark Doczy
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: H01L21/338
- IPC: H01L21/338

Abstract:
A hard mask may be formed and maintained over a polysilicon gate structure in a metal gate replacement technology. The maintenance of the hard mask, such as a nitride hard mask, may protect the polysilicon gate structure 14 from the formation of silicide or etch byproducts. Either the silicide or the etch byproducts or their combination may block the ensuing polysilicon etch which is needed to remove the polysilicon gate structure and to thereafter replace it with an appropriate metal gate technology.
Public/Granted literature
- US20050026408A1 Preventing silicide formation at the gate electrode in a replacement metal gate technology Public/Granted day:2005-02-03
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