发明授权
- 专利标题： Current-leveling electroplating/electropolishing electrode
- 专利标题（中）： 电流调平电镀/电解抛光电极
-
申请号： US10971836申请日： 2004-10-22
-
公开(公告)号： US07803257B2公开(公告)日： 2010-09-28
- 发明人: Shih-Chieh Chang , Ying-Lang Wang , Kei-Wei Chen , Shih-Ho Lin , Chun-Chang Chen
- 申请人： Shih-Chieh Chang , Ying-Lang Wang , Kei-Wei Chen , Shih-Ho Lin , Chun-Chang Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company
- 当前专利权人： Taiwan Semiconductor Manufacturing Company
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Tung & Associates
- 主分类号： C25D17/14
- IPC分类号： C25D17/14 ; C25D17/12
摘要：
A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.