发明授权
- 专利标题： Bonding pad for contacting a device
- 专利标题（中）： 用于接触设备的接合垫
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申请号： US11854296申请日： 2007-09-12
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公开(公告)号： US07816791B2公开(公告)日： 2010-10-19
- 发明人: Carsten Ahrens , Sven Albers , Klaus Gnannt , Ulrich Krumbein , Gunther Mackh , Patrick Schelauske , Berthold Schuderer , Georg Seidemann
- 申请人： Carsten Ahrens , Sven Albers , Klaus Gnannt , Ulrich Krumbein , Gunther Mackh , Patrick Schelauske , Berthold Schuderer , Georg Seidemann
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 优先权： DE102006043133 20060914
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.
公开/授权文献
- US20080067682A1 Bonding Pad for Contacting a Device 公开/授权日：2008-03-20
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