-
公开(公告)号:US07816791B2
公开(公告)日:2010-10-19
申请号:US11854296
申请日:2007-09-12
申请人: Carsten Ahrens , Sven Albers , Klaus Gnannt , Ulrich Krumbein , Gunther Mackh , Patrick Schelauske , Berthold Schuderer , Georg Seidemann
发明人: Carsten Ahrens , Sven Albers , Klaus Gnannt , Ulrich Krumbein , Gunther Mackh , Patrick Schelauske , Berthold Schuderer , Georg Seidemann
CPC分类号: H01L24/05 , H01L24/45 , H01L2224/04042 , H01L2224/05147 , H01L2224/05164 , H01L2224/05556 , H01L2224/05624 , H01L2224/05644 , H01L2224/45144 , H01L2224/48624 , H01L2224/48644 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/19043 , H01L2924/00014 , H01L2924/00
摘要: A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.
摘要翻译: 衬底上的接合焊盘具有在器件和接合区域之间建立电连接的第一金属结构和布置在接合区域处的第二金属结构。 所述第一金属结构在所述接合区域内延伸所述基板与所述第二金属结构之间的所述接合区域的至少一部分以与所述第二金属结构接触,所述第二金属结构比所述第一金属结构硬。
-
公开(公告)号:US20080067682A1
公开(公告)日:2008-03-20
申请号:US11854296
申请日:2007-09-12
申请人: Carsten Ahrens , Sven Albers , Klaus Gnannt , Ulrich Krumbein , Gunther Mackh , Patrick Schelauske , Berthold Schuderer , Georg Seidemann
发明人: Carsten Ahrens , Sven Albers , Klaus Gnannt , Ulrich Krumbein , Gunther Mackh , Patrick Schelauske , Berthold Schuderer , Georg Seidemann
IPC分类号: H01L23/52 , H01L21/4763
CPC分类号: H01L24/05 , H01L24/45 , H01L2224/04042 , H01L2224/05147 , H01L2224/05164 , H01L2224/05556 , H01L2224/05624 , H01L2224/05644 , H01L2224/45144 , H01L2224/48624 , H01L2224/48644 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/19043 , H01L2924/00014 , H01L2924/00
摘要: A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.
摘要翻译: 衬底上的接合焊盘具有在器件和接合区域之间建立电连接的第一金属结构和布置在接合区域处的第二金属结构。 所述第一金属结构在所述接合区域内延伸所述基板与所述第二金属结构之间的所述接合区域的至少一部分以与所述第二金属结构接触,所述第二金属结构比所述第一金属结构硬。
-
3.
公开(公告)号:US07660175B2
公开(公告)日:2010-02-09
申请号:US12040719
申请日:2008-02-29
申请人: Dieter Kohlert , Erhard Sixt , Rainer Holmer , Georg Seidemann , Berthold Schuderer , Gunther Mackh , Sabine Penka , Grit Schwalbe-Dietrich , Bernhard Duschinger , Josef Hermann
发明人: Dieter Kohlert , Erhard Sixt , Rainer Holmer , Georg Seidemann , Berthold Schuderer , Gunther Mackh , Sabine Penka , Grit Schwalbe-Dietrich , Bernhard Duschinger , Josef Hermann
IPC分类号: G11C7/00
CPC分类号: G11C29/48 , G11C29/1201 , G11C2029/0403
摘要: An embodiment of an integrated circuit comprises a plurality of cells. Each cell comprises a first supply node, a second supply node, a series connection with a first transistor, a second transistor and an electrical element. The series connection is coupled between the first and the second supply node. The electrical element includes a first and a second node. A third transistor is coupled between the first node of the electrical element and a first output node of the cell and a fourth transistor is coupled between the second node of the electrical element and the second output node of the cell. A control terminal of the first, the third and the fourth transistor is coupled to a first control node of the cell and a control terminal of the second transistor is coupled to a second control node of the cell.
摘要翻译: 集成电路的实施例包括多个单元。 每个单元包括第一电源节点,第二电源节点,与第一晶体管的串联连接,第二晶体管和电气元件。 串联连接耦合在第一和第二供电节点之间。 电气元件包括第一和第二节点。 第三晶体管耦合在电元件的第一节点和单元的第一输出节点之间,第四晶体管耦合在电元件的第二节点和单元的第二输出节点之间。 第一,第三和第四晶体管的控制端子耦合到单元的第一控制节点,并且第二晶体管的控制端耦合到单元的第二控制节点。
-
4.
公开(公告)号:US20090219773A1
公开(公告)日:2009-09-03
申请号:US12040719
申请日:2008-02-29
申请人: Dieter Kohlert , Erhard Sixt , Rainer Holmer , Georg Seidemann , Berthold Schuderer , Gunther Mackh , Sabine Penka , Grit Schwalbe-Dietrich , Bernhard Duschinger , Josef Hermann
发明人: Dieter Kohlert , Erhard Sixt , Rainer Holmer , Georg Seidemann , Berthold Schuderer , Gunther Mackh , Sabine Penka , Grit Schwalbe-Dietrich , Bernhard Duschinger , Josef Hermann
CPC分类号: G11C29/48 , G11C29/1201 , G11C2029/0403
摘要: An embodiment of an integrated circuit comprises a plurality of cells. Each cell comprises a first supply node, a second supply node, a series connection with a first transistor, a second transistor and an electrical element. The series connection is coupled between the first and the second supply node. The electrical element includes a first and a second node. A third transistor is coupled between the first node of the electrical element and a first output node of the cell and a fourth transistor is coupled between the second node of the electrical element and the second output node of the cell. A control terminal of the first, the third and the fourth transistor is coupled to a first control node of the cell and a control terminal of the second transistor is coupled to a second control node of the cell.
摘要翻译: 集成电路的实施例包括多个单元。 每个单元包括第一电源节点,第二电源节点,与第一晶体管的串联连接,第二晶体管和电气元件。 串联连接耦合在第一和第二供电节点之间。 电气元件包括第一和第二节点。 第三晶体管耦合在电元件的第一节点和单元的第一输出节点之间,第四晶体管耦合在电元件的第二节点和单元的第二输出节点之间。 第一,第三和第四晶体管的控制端子耦合到单元的第一控制节点,并且第二晶体管的控制端耦合到单元的第二控制节点。
-
公开(公告)号:US20180095426A1
公开(公告)日:2018-04-05
申请号:US15282615
申请日:2016-09-30
申请人: Sven Albers , Klaus Reingruber , Andreas Wolter , Georg Seidemann , Christian Geissler , Thorsten Meyer , Gerald Ofner
发明人: Sven Albers , Klaus Reingruber , Andreas Wolter , Georg Seidemann , Christian Geissler , Thorsten Meyer , Gerald Ofner
IPC分类号: G04B37/14 , H04B1/3827 , A44C5/02 , A44C5/00 , A44C5/14
CPC分类号: G04B37/1486 , A44C5/0053 , A44C5/02 , A44C5/105 , A44C5/14 , G06F1/163 , H04B1/385 , H04B2001/3861 , H04W4/80
摘要: A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.
-
公开(公告)号:US20150243572A1
公开(公告)日:2015-08-27
申请号:US14189938
申请日:2014-02-25
申请人: Sven Albers , Sonja Koller , Thorsten Meyer , Georg Seidemann , Christian Geissler , Andreas Wolter
发明人: Sven Albers , Sonja Koller , Thorsten Meyer , Georg Seidemann , Christian Geissler , Andreas Wolter
CPC分类号: H01L21/56 , H01L21/568 , H01L21/78 , H01L23/3128 , H01L23/562 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00
摘要: Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a die having a first side and a second side disposed opposite to the first side. The IC package may further include an encapsulation material encapsulating at least a portion of the die and having a first surface that is adjacent to the first side of the die and a second surface disposed opposite to the first surface. In embodiments, the second surface may be shaped such that one or more cross-section areas of the IC package are thinner than one or more other cross-section areas of the IC package. Other embodiments may be described and/or claimed.
摘要翻译: 本公开的实施例涉及集成电路(IC)封装,其包括具有与第一侧相对设置的第一侧和第二侧的管芯。 IC封装还可以包括封装模具的至少一部分并且具有与模具的第一侧相邻的第一表面的封装材料和与第一表面相对设置的第二表面。 在实施例中,第二表面可以被成形为使得IC封装的一个或多个横截面积比IC封装的一个或多个其它横截面积更薄。 可以描述和/或要求保护其他实施例。
-
公开(公告)号:US20150048520A1
公开(公告)日:2015-02-19
申请号:US13965746
申请日:2013-08-13
CPC分类号: H01L25/0657 , H01F7/04 , H01L23/32 , H01L23/49811 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/50 , H01L2224/10135 , H01L2224/10165 , H01L2224/11332 , H01L2224/11522 , H01L2224/132 , H01L2224/13298 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13444 , H01L2224/13464 , H01L2224/13469 , H01L2224/1601 , H01L2224/16225 , H01L2224/16227 , H01L2224/811 , H01L2224/81139 , H01L2224/8114 , H01L2224/81193 , H01L2225/06513 , H01L2225/06527 , H01L2225/06531 , H01L2225/06568 , H01L2225/06593 , H01L2225/06596 , H01L2924/014 , H01L2924/00014 , H01L2924/207 , H01L2924/00012
摘要: Embodiments of the present disclosure are directed to integrated circuit (IC) package assemblies with magnetic contacts, as well as corresponding fabrication methods and systems incorporating such magnetic contacts. A first IC substrate may have a first magnet coupled with a first electrical routing feature. A second IC substrate may have a second magnet coupled with a second electrical routing feature. The magnets may be embedded in the IC substrates and/or electrical routing features. The magnets may generate a magnetic field that extends across a gap between the first and second electrical routing features. Electrically conductive magnetic particles may be applied to one or both of the IC substrates to form a magnetic interconnect structure that extends across the gap. In some embodiments, magnetic contacts may be demagnetized by heating the magnets to a corresponding partial demagnetization temperature (PDT) or Curie temperature. Other embodiments may be described and/or claimed.
摘要翻译: 本公开的实施例涉及具有磁性触点的集成电路(IC)封装组件,以及包含这种磁性触点的对应的制造方法和系统。 第一IC基板可以具有与第一电路径特征耦合的第一磁体。 第二IC基板可以具有与第二电路径特征耦合的第二磁体。 磁体可以嵌入在IC基板和/或电路径特征中。 磁体可以产生延伸穿过第一和第二电路由特征之间的间隙的磁场。 可以将导电磁性颗粒施加到IC基板中的一个或两个以形成跨越间隙延伸的磁互连结构。 在一些实施例中,通过将磁体加热到对应的部分退磁温度(PDT)或居里温度,磁接触件可以去磁。 可以描述和/或要求保护其他实施例。
-
公开(公告)号:US20180092443A1
公开(公告)日:2018-04-05
申请号:US15282633
申请日:2016-09-30
申请人: Sven Albers , Klaus Reingruber , Andreas Wolter , Georg Seidemann , Christian Geissler , Thorsten Meyer , Gerald Ofner
发明人: Sven Albers , Klaus Reingruber , Andreas Wolter , Georg Seidemann , Christian Geissler , Thorsten Meyer , Gerald Ofner
IPC分类号: A44C5/02 , H04B1/3827 , A45F5/00 , A44C5/00 , G01D11/30 , A61B5/0205 , A61B5/00
CPC分类号: G06F1/163 , A44C5/00 , A44C5/02 , A44C5/105 , A45F5/00 , A45F2005/008 , A45F2200/0508 , A61B5/02055 , A61B5/021 , A61B5/02438 , A61B5/1112 , A61B5/681 , A61B2560/0257 , A61B2560/0443 , A61B2562/0219 , G04B37/1486 , G04B47/00 , H04B1/385
摘要: A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.
-
公开(公告)号:US20150333022A1
公开(公告)日:2015-11-19
申请号:US14280110
申请日:2014-05-16
申请人: Sven Albers , Georg Seidemann , Sonja Koller , Stephan Stoeckl , Shubhada H. Sahasrabudhe , Sandeep B. Sane
发明人: Sven Albers , Georg Seidemann , Sonja Koller , Stephan Stoeckl , Shubhada H. Sahasrabudhe , Sandeep B. Sane
IPC分类号: H01L23/00 , H01L23/498
CPC分类号: H01L24/05 , H01L23/49811 , H01L23/49816 , H01L24/03 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/141 , H01L2224/16238 , H01L2924/15311 , H01L2924/3511 , H05K1/111 , H05K3/3436 , H05K2201/0373
摘要: Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.
摘要翻译: 这里公开了与集成电路(IC)封装一起使用的接触焊盘。 在一些实施例中,本文公开的接触垫可以设置在IC封装的基板上,并且可以包括金属突出部分和金属凹部。 金属突出部和金属凹部中的每一个可以具有焊料接触表面。 金属凹部的焊接接触表面可以与金属突出部的焊接接触表面间隔开。 本文还公开了相关的设备和技术,并且可以要求保护其他实施例。
-
公开(公告)号:US20150084202A1
公开(公告)日:2015-03-26
申请号:US14038248
申请日:2013-09-26
申请人: Georg Seidemann , Sven Albers , Teodora Ossiander , Michael Skinner , Hans-Joachim Barth , Harald Gossner , Reinhard Mahnkoph , Christian Mueller , Wolfgang Molzer
发明人: Georg Seidemann , Sven Albers , Teodora Ossiander , Michael Skinner , Hans-Joachim Barth , Harald Gossner , Reinhard Mahnkoph , Christian Mueller , Wolfgang Molzer
IPC分类号: H01L23/00 , H01L25/00 , H01L25/065
CPC分类号: H01L24/09 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/80 , H01L24/81 , H01L25/0655 , H01L25/50 , H01L2224/03444 , H01L2224/0346 , H01L2224/03602 , H01L2224/0401 , H01L2224/04042 , H01L2224/05009 , H01L2224/05013 , H01L2224/05014 , H01L2224/05015 , H01L2224/05016 , H01L2224/05553 , H01L2224/05556 , H01L2224/05571 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/06135 , H01L2224/06155 , H01L2224/06183 , H01L2224/08054 , H01L2224/08056 , H01L2224/08057 , H01L2224/08121 , H01L2224/08137 , H01L2224/08225 , H01L2224/09135 , H01L2224/09183 , H01L2224/1134 , H01L2224/131 , H01L2224/16137 , H01L2224/48137 , H01L2224/80201 , H01L2224/80895 , H01L2224/81203 , H01L2224/94 , H01L2924/00014 , H01L2924/1434 , H01L2224/03 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: An apparatus comprises a first integrated circuit (IC) die that includes a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, a second IC die including a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, wherein the second IC die is arranged adjacent to the first IC die, and includes an electrically conductive bond in contact with at least one of the top surface or the side surface of the multi-surface contact pad of the first IC die and the top surface of the multi-surface contact pad of the second IC die.
摘要翻译: 一种装置包括第一集成电路(IC)芯片,其包括顶层,底表面,从顶层的顶表面延伸到底表面的侧壁表面,以及至少一个多表面接触垫,第二 IC芯片包括顶层,底面,从顶层的顶表面延伸到底表面的侧壁表面,以及至少一个多表面接触焊盘,其中第二IC管芯被布置为与第一IC 并且包括与第一IC管芯的多表面接触焊盘的顶表面或侧表面中的至少一个与第二IC管芯的多表面接触焊盘的顶表面接触的导电接合 。
-
-
-
-
-
-
-
-
-