发明授权
- 专利标题： Terminal pad structures and methods of fabricating same
- 专利标题（中）： 端子焊盘结构及其制造方法
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申请号： US12348934申请日： 2009-01-06
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公开(公告)号： US07829452B2公开(公告)日： 2010-11-09
- 发明人: Douglas D. Coolbaugh , Daniel C. Edelstein , Ebenezer E. Eshun , Zhong-Xiang He , Robert M. Rassel , Anthony K. Stamper
- 申请人： Douglas D. Coolbaugh , Daniel C. Edelstein , Ebenezer E. Eshun , Zhong-Xiang He , Robert M. Rassel , Anthony K. Stamper
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Schmeiser, Olsen & Watts
- 代理商 Joseph Petrokaitis
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
Terminal pads and methods of fabricating terminal pads. The methods including forming a conductive diffusion barrier under a conductive pad in or overlapped by a passivation layer comprised of multiple dielectric layers including diffusion barrier layers. The methods including forming the terminal pads subtractively or by a damascene process.
公开/授权文献
- US20090155993A1 TERMINAL PAD STRUCTURES AND METHODS OF FABRICATING SAME 公开/授权日：2009-06-18
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