发明授权
US07842905B2 Method and device for the thermal treatment of substrates 有权
用于基材热处理的方法和装置

Method and device for the thermal treatment of substrates
摘要:
This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.
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